Taiwan Semiconductor Manufacturing Comp. Ltd.

Phison Electronics Corporation

Chin-Min Lin

Dun-Nian Yaung

Cheng San Chou

Ching-Chun Wang

Tzu-Hsuan Hsu

Wen-Chuan Tai

Hsiang-Fu Chen

Chun-Ming Su

Chia-Ming Hung

Hsin-Ting Huang

Hua-Shu Ivan Wu

Fan Hu

Wei-Ding Wu

Han-Zong Pan

Ching-Kai Shen

You-Cheng Jhang

Cheng-San Chou

Yi-Chia Lee

Hsin-Yu Chen

Bruce C S Chou

Allen Timothy Chang

Hung-Jen Hsu

Shao-Chi Yu

Yeou-Lang Hsieh

Ken Wen-Chien Fu

Jiann-Jong Wang

Jiu-Chun Weng

Chun-Chieh Chuang

Kuan-Chieh Huang

Jui-Chun Weng

Chen Hsiung Yang

Hsin-yu Chen

De-Fang Huang

Yueh-Hsuan Tsai

Tzu-Yin Lin

Ching-Hui Tsao

Ke Chun Liu

Mingo Lin

Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.

Multi-wafer integration

Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

Optical sensor and methods of making the same

A display apparatus is disclosed. The display apparatus includes a sensor layer including a plurality of sensors, a pixel layer disposed on the sensor layer and including a plurality of pixel areas and a plurality of pixels in the pixel areas, and an opaque layer disposed between the sensor layer and the pixel layer and including holes corresponding to at least one of the pixel areas.

Biometric sensor and methods thereof

According to one example, a device includes a semiconductor substrate. The device further includes a plurality of color filters disposed above the semiconductor substrate. The device further includes a plurality of micro-lenses disposed above the set of color filters. The device further includes a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses. The structure and the color filters are level at respective top surfaces and bottom surfaces thereof.

Apparatus for reducing optical cross-talk in image sensors

A method of fabricating a sensing apparatus is disclosed. The method includes providing a substrate that includes a plurality of image sensors, forming an optical filtering film on the substrate, and forming a collimator on the optical filtering film. The method further includes forming a blocking layer on the collimator and forming an illumination layer on the blocking layer. The illumination layer is configured to illuminate an object placed above the illumination layer. The image sensors are configured to detect a portion of light reflected from the object.

The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

A sensing apparatus is disclosed. The sensing apparatus includes an image sensor; a collimator above the image sensor, the collimator having an array of apertures; an optical filtering layer between the collimator and the image sensor, wherein the optical filtering layer is configured to filter a portion of light transmitted through the array of apertures; and an illumination layer above the collimator.

According to one example, a device includes a semiconductor substrate. The device further includes a plurality of color filters disposed above the semiconductor substrate. The device further includes a plurality of micro-lenses disposed above the set of color filters, each micro-lens of the plurality of micro-lenses being configured to direct light radiation. The device further includes a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses. The structure and the color filters are level at respective top surfaces and bottom surfaces thereof.

A data writing method, a memory control circuit unit and a memory storage apparatus are provided. The method includes: receiving a first write command and first data corresponding to the first write command, and writing the first data into a third physical erasing unit in first physical erasing units; and if a usage frequency of a fourth physical erasing unit in the first physical erasing units is less than a predetermined value, performing a data arrangement operation corresponding to the first write command to copy second data stored by the fourth physical to at least one of second physical erasing units.

Data writing method, memory control circuit unit and memory storage apparatus which performs data arrangement operation according to usage frequency of physical erasing unit of memory storage apparatus

Growing community of inventors

Hsinchu, Taiwan

Chin-Min Lin