Innolux Corporation

Carux Technology Pte. Ltd.

Chin-Lung Ting

Chung-Kuang Wei

Ker-Yih Kao

Li-Wei Mao

Ming-Chun Tseng

I-Yin Li

Yi-Hung Lin

Chih-Yung Hsieh

Cheng-Chi Wang

Chia-Chi Ho

Chi-Liang Chang

Liang-Lu Chen

I-Chang Liang

Kung-Chen Kuo

Hong-Sheng Hsieh

Shun-Yuan Hu

Cheng-Hsu Chou

Yen-Liang Chen

Fang-Ho Lin

Chia-Hui Lin

Chien-Chih Chen

Chia-Ping Tseng

Tong-Jung Wang

Ming-Hui Chu

Chia-Lun Chen

Ming-Chia Shih

Tang-Chin Hung

Kuang-Ming Fan

Yi Hung Lin

Chien-Hsing Lee

Hao Jung Huang

Tang Chin Hung

Kuan-Feng Lee

Yu-Chia Huang

Shu-Ming Kuo

Ming Chun Tseng

Chih-Chieh Wang

Hui-Chi Wang

Sheng-Nan Chen

Heng-Chang Chang

Chi-Fang Wu

Jung-Chuan Wang

Ti Chung Chang

Jenhung Li

Po-Wen Lin

Chih-Chiang Chang Chien

Tai-Chi Pan

Cheng-Fu Wen

Tsau-Hua Hsieh

Jui-Jen Yueh

Chandra Lius

Jian-Cheng Chen

Lien-Hsiang Chen

Hui-Min Huang

Hao-Yu Liou

Chia-Chieh Fan

Jen-Hai Chi

Yan-Zheng Wu

Ming-I Chao

Yi-An Chen

Ming-Tsang Wu

Chen-Lin Yeh

Kuan-Hung Kuo

Jeng-Nan Lin

Ho-Tien Chen

Chin-Der Chen

Tsung-Han Tsai

Yuan-Lin Wu

Li-Wei Sung

Chien-Hung Chen

Yeong-E Chen

Ying-Jen Chen

Yi-Hua Hsu

Minoru Shibazaki

Wei-Cheng Chu

Yun-Sheng Chen

Hsu-Kuan Hsu

Ruey-Jer Weng

Kazuto Jitsui

Wen-Hsiang Liao

Chia-Cheng Liu

Keiko Edo

Shih-Chang Huang

Huei-Ying Chen

Ayumu Mori

Chien-Tzu Chu

Yu-Sheng Chen

Chih-Yuan Lee

Hsiu-Tung Lin

Yi-Hsin Chen

Kuan-Jen Wang

Yu-Jen Chang

Cheng-I Wu

Ying-Shiang Huang

Jia-Huei Lin

Ming-Hsien Shih

Shan-Hung Tsai

Chien-Chang Lu

Chen-Chang Wang

Kuang-Hsiang Lee

An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

Electronic device and method of fabricating an electronic device

Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

Electronic device

An electronic device includes: a first substrate; a second substrate, disposed below the first substrate; a first protection element, disposed on a surface of the first substrate away from the second substrate; and a second protection element, disposed on a surface of the second substrate away from the first substrate, wherein a width of the insulating layer is different from a width of the second protection element.

The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.

Method for manufacturing electronic device

A display panel and a spliced display are provided. The display panel includes a substrate, a plurality of light-emitting elements, a driving circuit, and an optical sensor. The substrate includes a through hole, and the through hole includes a hole. The plurality of the light-emitting elements are disposed on the substrate. The through hole is located in a region between two of the plurality of the light-emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of the light-emitting elements. The optical sensor is disposed corresponding to the through hole and receives sensing light through the hole. The width W of the hole meets the equation of H≤W<D. H is the depth of the hole, and D is the distance between the two of the plurality of the light-emitting elements.

An operation method of an electronic device for sensing an optical signal is provided. The electronic device includes a plurality of optical sensors and a plurality of light-emitting elements disposed adjacent to the plurality of optical sensors. The operation method of the electronic device for sensing the optical signal includes the following steps. The optical signal is provided to a first optical sensor of the plurality of optical sensors. The first optical sensor outputs a driving signal when dimming the plurality of light-emitting elements adjacent to the first optical sensor. Therefore, the accuracy of sensing the optical signal may be effectively increased.

Operation method of electronic device for sensing optical signal and electronic device

An electronic device is provided. The electronic device includes a base and a conductive layer that is disposed on the base and patterned by a plurality of processes. The plurality of processes include providing a mask substrate. The mask substrate includes a first substrate and a patterned substrate. In the cross-sectional view, the width of the first substrate is greater than or equal to the width of the patterned substrate. The plurality of processes include arranging the mask substrate and the base correspondingly. The plurality of processes also include performing exposure and development processes on the conductive layer for patterning the conductive layer, and removing the mask substrate.

Electronic device and method for manufacturing target substrate

An electronic device includes a substrate, a sidewall, a plurality of light emitting elements and an optical element. The sidewall is connected to the substrate. The plurality of light emitting elements are disposed on the substrate. The optical element covers at least two of the plurality of light emitting elements, wherein, in a cross-sectional view of the electronic device, a portion of the optical element is disposed between two adjacent ones of the plurality of light emitting elements, and a height of the sidewall is greater than a thickness of the optical element.

Electronic device with backlight module

A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

Method of forming electronic device

An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.

The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

A display device is provided. The display device includes a substrate, a channel layer, a first metal layer, and a second metal layer. The channel layer is disposed on the substrate and includes a first channel layer and a second channel layer. The first metal layer is disposed on the channel layer and includes a first gate and a second gate. The second metal layer is disposed over the first metal layer and includes a first source, a first drain, and a second source. The first gate, the first source, the first drain, and the first channel layer form a first transistor. The second gate, the second source, the first drain, and the second channel layer form a second transistor. The first transistor and the second transistor are connected in parallel.

Display device

A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding at least one electronic component to the substrate, wherein the at least one electronic component is mainly driven by a reverse bias in an operating mode; applying a forward bias to the at least one electronic component, and determining whether the at least one electronic component is normal or failed; and transporting the substrate configured with the at least one electronic component determined to be normal to a next production site or repairing the at least one electronic component determined to be failed.

Manufacturing method of electronic device

An antenna device is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. At least one working element disposed between the first substrate and the second substrate, wherein the at least one working element is filled with a modulation material. At least one buffer element is connected with the at least one working element for adjusting the amount of the modulation material in the at least one working element.

Antenna device

Growing community of inventors

Miao-Li County, Taiwan

Chin-Lung Ting