Ritdisplay Corporation

Chin-Long Wu

Shang-Wei Chen

Shih-Ming Hsu

Tung-Yang Tang

Sung-Yi Pai

Tien-wang Huang

Tein-Wang Huang

A packaging fabrication for an organic electroluminescence panel is disclosed. The panel comprises a printed circuit board, one or a plurality of OEL panels and a plurality of bumps, wherein the OEL is provided with poly solder interconnections in area array. The printed circuit board is provided with a plurality of solder pads arranged with bumps. One or a plurality of OEL is arranged on the printed circuit board and the poly solder interconnections and bumps are used to electrically connect the OEL with the printed circuit board. Further, the excellent heat dissipation property of the low re-flow temperature of the poly solder interconnections and the ceramic printed circuit board provides packaging fabrication for low temperature low stress OEL.

Method of fabricating organic electroluminescence panel package

An organic light-emitting panel includes a rear board, a heat spreader and a front board. In this case, the rear board has a first surface and a second surface opposite to the first surface. The heat spreader covers over the first surface and extends to the second surface. The heat spreader, which covers over the first surface of the rear board is formed with plural holes. The front board is set on the first surface and the heat spreader. The invention also discloses a manufacturing method of the panel. The method includes the steps of: fitting a rear board into a heat spreader in such a manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and adhering a front board to the first surface of the rear board and the heat spreader.

Organic light-emitting panel and manufacturing method thereof

A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.

Package structure of organic electroluminescence panel

A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.

Process of packaging organic electroluminescent panel

A package structure of OEL panel is composed of a printed circuit board, one or multiple OEL panels, and multiple bumps. Wherein, the OEL panel has multiple poly solder interconnection arranged in an array structure. The printed circuit board has multiple solder pads, and bumps are disposed on the solder pads. The one or more OEL panel are disposed on the printed circuit board with the electric coupling via the poly solder interconnections, so as to have the electric connection for the OEL panel and the printed circuit board.

Growing community of inventors

Tainan, Taiwan

Chin-Long Wu