Infineon Technologies Ag

Chin Kee Leow

Chan Lam Cha

Wern Ken Daryl Wee

Hoe Jian Chong

A chip package includes a chip with at least one contact pad, a contact structure formed from at least one continuous longitudinally extended electrically conductive element by attaching the conductive element to the contact pad in at least three contact positions, wherein the conductive element bends away from the contact pad between pairs of consecutive contact positions, and an encapsulation partially encapsulating the contact structure, wherein the encapsulation includes an outer surface facing away from the chip, and wherein the contact structure is partially exposed at the outer surface.

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Melaka, Malaysia

Chin Kee Leow