Htc Corporation

Chin-Kai Sun

Chih-Yao Kuo

Wei-Cheng Liu

Chung-Chiao Tan

Jen-Cheng Lai

Chun-Lung Chu

Jia-Yuan Hsu

Cheng-Chieh Chuang

Chun Tseng

Tung-Hsin Yeh

Tzu-Chia Tan

Sheng-Ming Liu

Chih-Lin Chang

Yi-Chang Huang

Hsiu-Fan Ho

Chieh-Pei Chou

I-Te Chen

A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 &#x3bc;m to 130 &#x3bc;m.

Fan blade and fabricating method thereof

An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.

Electronic device

An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.

A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.

Head-mounted display device

A head-mounted display device includes a display portion, a main frame, two arms, and two adjusting pieces. The main frame carries the display portion. The arms are disposed on opposite sides of the main frame, and the end portions of the arms are pivotally connected to the main frame such that the arms are adapted to rotate away from the main frame during an unfolding process and adapted to rotate toward the main frame during a folding process. The adjusting pieces are respectively disposed on pivot paths of the arms, and the adjusting piece is adapted to from a structural interference with the corresponding arm and the main frame during the unfolding process to limit a degree of rotation of the arm.

A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.

Heat dissipation module and electronic device

A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

Heat dissipation module manufacturing method, heat dissipation module and electronic device

A graphite thermal conductor includes graphite bands laminated in the thickness direction. The thermal conductivity coefficient of each graphite band in the extending path is greater than the thermal conductivity coefficient thereof in the thickness direction. The extending path of each graphite band has at least one first bend in a plane which is perpendicular to the thickness direction. An electronic device applying the above graphite thermal conductor and a method for manufacturing graphite thermal conductor are also provided.

Graphite thermal conductor, electronic device and method for manufacturing graphite thermal conductor

An electronic device and a component module thereof are provided, wherein the electronic device includes a housing, a component and a flexible substrate. The housing has a mounting region, and the component is disposed in the mounting region. The flexible substrate includes a bonding portion and an extending portion, wherein the bonding portion is disposed between the component and a carrying surface of the mounting region. The mounting portion has a first surface and a second surface opposite to the first surface, wherein the first surface is bonded to the component, and the second surface is bonded to the carrying surface. The extending portion is connected to the bonding portion and extended to the outside of the mounting region.

Electronic device and component module

An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing.

An electronic element supporting base and an electronic device applying the same are provided. The electronic element supporting base comprises a fixing portion and a carrying part. The fixing portion is suitable for being fixed to a frame of the electronic device as a fulcrum for the electronic element supporting base. The carrying part is suitable for carrying a plurality of electronic elements, wherein a gap exists between the carrying part and the frame, and a gap exists between the carrying part and the circuit board. When the electronic device receives an impact, the suspended design of the electronic element supporting base allows the carrying part to oscillate through the gaps, and the electronic element supporting base will not be squeezed, which prevents the electronic elements on the electronic element supporting base from being shifted.

Growing community of inventors

Taoyuan, Taiwan

Chin-Kai Sun