International Business Machines Corporation

Chin-Jong Chan

Lubomyr Taras Romankiw

Jei-Wei Chang

A metallurgical joint structure between two workpieces to be joined by soldering or brazing includes a stress release layer of a low yield point metal, preferably silver, gold, copper, palladium or platinum. The joint structure also includes a juxtaposed barrier layer to prevent the diffusion of a solder element, such as tin, to the stress release layer. Preferred barrier layers are chromium, titanium-tungsten and tantalum. Preferably, the joint includes one or more stress relief layer and associated barrier layer combinations in the joint structure for improved joint reliability.

Growing community of inventors

Fong-Shan, Taiwan

Chin-Jong Chan