Industrial Technology Research Institute

Chin-Hung Wang

Pin Chang

Feng-Chia Hsu

Tsun-Che Huang

Jien-Ming Chen

Hsin-Li Lee

Li-Chi Pan

Chin-Wen Huang

Jing-Yuan Lin

Ming-Ji Dai

Tzong-Che Ho

Chia-Yu Wu

Yu-Wei Huang

Chih-Ming Shen

Chien-Nan Yeh

Ming-Kaan Liang

Hsin-Tang Chien

Yu-Sheng Hsieh

Chieh-Ling Hsiao

Chun-Yin Tsai

Wei-Jr Lin

Di-Bao Wang

Chiung-I Lee

An apparatus for assembling devices, comprising a plurality of actuated devices disposed on a substrate, each of the actuated devices comprising a first electrode disposed on and electrically connect to the substrate, a connecting pad disposed on the substrate, an electro-active polymer layer comprising a first surface disposed on the connecting pad and a second surface, and a second electrode disposed on the second surface of the electro-active polymer layer and electrically connected to the substrate.

Apparatus for assembling devices

Provided is a roller with pressure sensor. The roller includes a pressure sensor mounted to the roller. The pressure sensor includes a plurality of pressure sensing units distributed on a thin film. The pressure sensing units are electrically connected to each other with a metal wire but not in contact with each other. Also provided is a roll-to-roll device, which includes a roller mechanism and a pressure sensor.

Roller with pressure sensor and R to R device

A pressure sensor and a manufacturing method of the same are provided. The pressure sensor includes a substrate, a dielectric oxide layer, a first electrode, a dielectric connection layer, and a second electrode. The dielectric oxide layer is formed on the substrate. The first electrode is formed on the dielectric oxide layer. The dielectric connection layer is formed on the first electrode. The second electrode is formed on the dielectric connection layer. The second electrode comprises a patterned conductive layer and a dielectric layer. The patterned conductive layer has a plurality of holes, and the dielectric layer is formed on the patterned conductive layer and covers the inner walls of the plurality of holes. The first electrode, the dielectric connection layer, and the second electrode define a first chamber between the first electrode and the second electrode.

Pressure sensor and manufacturing method of the same

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

MEMS acoustic transducer and method for fabricating the same

A capacitive transducer and manufacturing method thereof is provided. A multifunction device including a plurality of the capacitive transducers is also provided, where the capacitive transducers are disposed on a substrate and include at least one microphone and at least one pressure sensor or ultrasonic device.

Capacitive transducer manufacturing method, and multi-function device

The disclosure provides a structure for a microelectromechanical system (MEMS)-based resonator device. The structure for the MEMS-based resonator device includes at least one resonator unit. The at least one resonator unit comprises a substrate having a trench therein. A pair of first electrodes is disposed on a pair of sidewalls of the trench. A piezoelectric material fills the trench, covering the pair of first electrodes. A second electrode is embedded in the piezoelectric material, separated from the pair of first electrodes by the piezoelectric material. The second electrode disposed in the trench is parallel to the pair of first electrodes.

Microelectromechanical system-based resonator device

An inter-digital bulk acoustic resonator including a resonating structure, one or more input electrodes, one or more output electrodes, a substrate, and a supporting structure disposed on the substrate is provided. The resonating structure includes one or more resonating beams and a coupling beam. The resonating beams are connected at opposite two sides of the coupling beam respectively. The input electrodes and the output electrodes are arranged among the resonating beams in interlace. The input electrodes, the output electrodes, and the resonating beams are parallel to each other. Two ends of the coupling beam are connected to the supporting structure, such that the resonating structure is supported on the substrate.

Inter-digital bulk acoustic resonator

An ultrasonic transducer detector having a high operating frequency is provided. The ultrasonic transducer detector comprises a substrate and an ultrasonic transducer array. The substrate has a plurality of openings, and the ultrasonic transducer array is disposed on the substrate. The ultrasonic transducer array has a plurality of resonance units, and the thickness of each resonance unit is equivalent to &#xbd; wavelength of the operating frequency of the ultrasonic transducer. Each resonance unit comprises an oscillating element and a piezoelectric element. The oscillating element has a first surface adjacent to the substrate, and the piezoelectric element is disposed on the first surface and located in the corresponding opening.

Ultrasonic transducer detector with resonant unit having a thickness of half-wavelength of the operating frequency

A microelectromechanical filter is provided. The microelectromechanical filter includes an input electrode, an output electrode, one or several piezoelectric resonators, one or several high quality factor resonators, and one or several coupling beams. The input electrode and the output electrode are disposed on the piezoelectric resonators. The high quality factor resonator is silicon or of piezoelectric materials, and there is no metal electrode on top of the resonator. The coupling beam is connected between the piezoelectric resonator and the high quality factor resonator. The coupling beam transmits an acoustic wave among the resonators, and controls a bandwidth of filter. The microelectromechanical filter with low impedance and high quality factor fits the demand for next-generation communication systems.

Microelectromechanical filter

A resonator includes a resonating body and at least one periodic structure having one end connected to the resonating body. The periodic structure includes at least two basic structure units with duplicated configuration. The periodic structure blocks wave propagation caused by the vibration of the resonating body. The resonating body has a resonance frequency f. The periodic structure has a band gap characteristic or a deaf band characteristic within a particular frequency range, and the resonance frequency ffalls within the particular frequency range of the periodic structure.

Resonator and periodic structure

A resonator, an elastic wave transmission element and a method for fabricating the transmission element are provided. The elastic wave transmission element has a first side and a second side. The elastic wave transmission element includes a plurality of structures sequentially arranged along a direction from the first side toward the second side. Each of the structures has a different defect which is different to each other. The impedance of the structures decreases gradually along the direction. As such, the elastic wave transmission element has an impedance match function.

Resonator, elastic wave transmission element and fabrication method thereof

A truss structure is provided. The truss structure comprises a substrate; and plural sub-truss groups disposed on the substrate, wherein each sub-truss group comprises plural VIAs; and plural metal layers interlaced with the plural VIAs, wherein the plural sub-truss groups are piled up on each other to form a 3-D corrugate structure.

Truss structure and manufacturing method thereof

A multi-actuation MEMS switch for high frequency signals includes a substrate, a heater disposed on the substrate, a co-planar waveguide disposed on a lowest metal layer, and a movable membrane including at least two metal layers, and an dielectric layer disposed between the co-planar waveguide and the movable membrane. The movable membrane is a fixed-fixed beam structure with a center indentation. When heat is generated and conducted to the movable membrane or electrostatic force is generated between the movable membrane and the co-planar waveguide or both forces are generated, the movable membrane will bend toward the co-planar waveguide. The position of the movable membrane change capacitance on signal line for switching the RF signal.

Multi-actuation MEMS switch

A stacked package structure utilizes flip-chip technology to stack an acoustic micro-sensor on an integrated circuit (IC) device having a recess as a back chamber and cover the acoustic micro-sensor using a glass substrate or a planar substrate with an aperture. With the use of the stacked package structure, the package volume of the acoustic micro-sensor can be reduced effectively.

Growing community of inventors

Hsinchu, Taiwan

Chin-Hung Wang