Wistron Corporation

Foxconn Technology Co., Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Chin-Hsien Chen

Wen-Chin Wu

Chien Yu Huang

Chun-Peng Hsu

Hsien-Wei Chen

Der-Chyang Yeh

Wei-Cheng Wu

An-Jhih Su

Li-Hsien Huang

Rung-An Chen

Yan-Fu Lin

Chih-Hua Hsu

Jung-Shiung Liau

Yung-Shou Cheng

Gustavo Salazar

Methods of testing, manufacturing, and packaging semiconductor devices are disclosed. In some embodiments, a method of testing a semiconductor device includes providing an integrated circuit die having contacts disposed thereon, forming an insulating material over the integrated circuit die and the contacts, and forming an opening in the insulating material over the contacts. A eutectic material is formed in the openings over the contacts, and the integrated circuit die is electrically tested by contacting the eutectic material disposed over the contacts. The eutectic material is removed.

Testing, manufacturing, and packaging methods for semiconductor devices

A mechanism device includes a hinge mechanism, a holding base, a guiding member and a fixing member. The holding base is pivoted to the frame by the hinge mechanism and includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing extend from two opposite sides of the main casing along a direction away from the hinge mechanism, such that the main casing, the first holding casing and the second holding casing cooperatively define a holding slot with openings formed on two sides thereof, so as to hold an electronic device. The guiding member is disposed within the holding slot and for guiding the electronic device into the holding slot. The fixing member is disposed within the holding slot and for fixing the electronic device inside the holding slot after the electronic device enters the holding slot.

Mechanism device with rotary holder and display device therewith

An adjustable docking device includes a hinge mechanism, a holding base, a guiding member, and a fixing mechanism. The hinge mechanism is installed on a frame. The holding base is pivoted to the frame by the hinge mechanism. The holding base includes a main casing, a first holding casing and a second holding casing. The first holding casing and the second holding casing respectively extends from the main casing. The main casing, the first holding casing, and a second holding casing cooperatively define a clamping slot for holding an electronic device. The guiding member is disposed inside the clamping slot and for guiding the electronic device into the clamping slot. The fixing mechanism is disposed inside the holding base and capable of switching between a locking status and a releasing status, so as to lock or release the electronic device.

Adjustable docking device and display device therewith

An electronic device includes a casing and a fan received in the casing. The fan includes a cover plate, a bottom plate and a side wall. An air outlet is defined in the side wall. The bottom plate defines an air inlet. The casing includes a bottom cover and a top cover. The bottom cover includes a base plate, and a side plate extending upwardly from a periphery of the base plate. The bottom plate includes a horizontal first area and a second area inclining relative to the first area. A height of the base plate relative to a horizontal plane gradually increases from one side of the casing to another side of the casing. A height of the second area relative to the horizontal plane also gradually increases from the one side of the casing to another side of the casing.

Electronic device with fan

A backlight module includes a flexible circuit board. The flexible circuit board includes a conductive layer and an insulating layer covering the conductive layer. The backlight module further includes a plurality of light emitting diodes respectively disposed on two sides of the flexible circuit board and electrically connected to the conductive layer of the flexible circuit board for emitting light towards the two sides of the flexible circuit board.

Backlight module and display device with two-sided light emitting structure

An exemplary fixing device is for mounting a heat conduction plate to two electronic components. The fixing device includes a first mounting clip and a second mounting clip connected to the first mounting clip through arms. The first mounting clip includes a pressing plate pressing a first contacting portion of the heat conduction plate against one electronic component. The second mounting clip includes two pressing tabs pressing a second contacting portion of the heat conduction plate against the other electronic component. The pressing plate and the two pressing tabs are made of a single monolithic piece of material.

Fixing device and thermal module incorporating the same

A thermal module includes a heat sink (), a heat pipe () and a fastening device (). The heat pipe has a condenser section () connected with the heat sink. The fastening device includes a base member () for fixing an evaporator section of the heat pipe, a positioning pole () disposed on and connected to the base member, and an elastic member (). The positioning pole includes a neck () and a head (). The elastic member includes an abutting portion () defining therein a positioning hole (), and two locking portions () extending from the abutting portion. The neck of the positioning pole is freely and loosely received in the positioning hole of the abutting portion. A maximal outer diameter of the head of the positioning pole exceeds a diameter of the fixing hole.

Growing community of inventors

Taipei, Taiwan

Chin-Hsien Chen