Advanpack Solutions Pte Ltd.

Chin Guan Khaw

Amlan Sen

The present invention describes two systems () for encapsulation of semiconductor dies. Both systems () involve attaching an encapsulation spacer () having one or more apertures () on an associated substrate () so that a group of chips is located within the aperture (). The first system () involves dispensing encapsulant () directly into an aperture. The second system () involves attaching an encapsulant delivery layer () onto the encapsulation spacer and discharging encapsulant into an aperture via a recessed gate ().

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Singapore, Singapore

Chin Guan Khaw