Industrial Technology Research Institute

Chin-Fu Kuo

Chao-Ta Huang

Yu-Wen Hsu

Chung-Yuan Su

Liang-Ying Liu

Yu-Sheng Lin

Che-Kai Yeh

Chih-Yuan Chen

Jien-Ming Chen

Chia-Yu Wu

Lu-Po Liao

Tzung-Ching Lee

Di-Bao Wang

Lu-Pu Liao

A reading device for capacitive sensing element comprises a differential capacitive sensing element, a modulator, a charge-voltage conversion circuit, a phase adjustment circuit, a demodulator and a low-pass filter. The modulator outputs a modulation signal to the common node of the capacitive sensing element and modulates the output signal of the capacitive sensing element. The two input terminals of the charge-to-voltage conversion circuit are connected to two non-common nodes of the capacitive sensing element. The charge-to-voltage converter read the output charge of the capacitive sensing element and convert it into a voltage signal. The modulator generates a demodulation signal through the phase adjustment circuit. The demodulator receives the demodulation signal from the phase adjustment circuit and demodulates the output of the charge-to-voltage conversion circuit. The low-pass filter is connected to the output of the demodulator for filtering the demodulated voltage signal to output the read signal.

Reading device for capacitive sensing element

A microelectromechanical sensing apparatus with calibration function comprises a microelectromechanical sensor and an IC chip. The microelectromechanical sensor comprises a proof mass, a movable driving electrode and a movable sensing electrode disposed on the proof mass, and a stationary driving electrode and stationary sensing electrode disposed on a substrate, wherein the sensing electrodes output a sensing signal when the proof mass vibrates. The IC chip comprises a conversion module electrically connected to the microelectromechanical sensor, wherein the conversion module converts the sensing signal into an input spectrum signal, and a calibration module electrically connected to the conversion module, wherein the calibration module receives the input spectrum signal and transforms the input spectrum signal into an output spectrum signal; wherein, the output spectrum signal is equal amplitude spectrum signal when the microelectromechanical sensor is subjected to an equal amplitude vibration and the input spectrum signal is an unequal amplitude spectrum signal.

Microelectromechanical sensing apparatus with calibration function

The differential capacitor device includes a differential capacitor sensing component, a calibration capacitor assembly and two output terminals. The differential capacitive sensing element has a common point terminal, a first non-common point terminal and a second non-common point terminal, and the common point terminal is configured to receive an input voltage. The calibration capacitor assembly has a first calibration capacitor and a second calibration capacitor, one terminal of the calibration capacitor assembly is coupled to the first non-common point terminal and the second non-common point terminal, and the other terminal of the calibration capacitor assembly is configured to receive a first calibration voltage and a second calibration voltage. The two output terminals are respectively coupled to the first non-common point terminal and the second non-common point terminal to output a first signal and a second signal.

Differential capacitor device and method for calibrating differential capacitor

A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.

MEMS device with movable stage

An adjustable sensing capacitance microelectromechanical system (MEMS) apparatus includes an ASIC and a sensing component. The ASIC includes a top surface, a readout circuit and a plurality of electrical switches. The sensing component, configured to sensing physical quantity, includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode is able to be moved relative to the fixed electrode. The electrical switches are respectively and electrically coupled to the electrode units so as to control a working status of each of the electrode units, thereby changing a sensing capacitance of the MEMS sensor.

Adjustable sensing capacitance microelectromechanical system (MEMS) apparatus

A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

MEMS apparatus having impact absorber

A micro-electromechanical apparatus with multiple chambers and a method for manufacturing the same are provided, wherein various micro-electromechanical sensors are integrated into a single apparatus. For example, the micro-electromechanical apparatus in this disclosure may have two independent hermetically sealed chambers with different pressures, such that a micro-electromechanical barometer and a micro-electromechanical accelerometer can be operated in an optimal pressure circumstance.

Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same

A micro-electro mechanical apparatus having a PN-junction is provided. The micro-electro mechanical apparatus includes a movable mass, a conductive layer, and an electrode. The movable mass includes a P-type semiconductor layer and an N-type semiconductor layer. The PN-junction is formed between the P-type semiconductor layer and the N-type semiconductor layer. The micro-electro mechanical apparatus is capable of eliminating abnormal voltage signal when an alternating current passes through the conductive layer. The micro-electro mechanical apparatus is adapted to measure acceleration and magnetic field. The micro-electro mechanical apparatus can be other types of micro-electro mechanical apparatus such as micro-electro mechanical scanning micro-mirror.

Micro-electro mechanical apparatus with PN-junction

A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.

Microelectromechanical system device with electrical interconnections and method for fabricating the same

According to an embodiment of the disclosure, an acoustics transducer is provided, which includes a support substrate having an upper surface and a lower surface, the upper surface including a first portion and a second portion surrounding the first portion, a recess extending from the upper surface towards the lower surface, the recess is between the first portion and the second portion of the upper surface, a vibratable membrane disposed directly on the recess, the vibratable membrane including a fixed portion fixed on the support substrate and a suspended portion, and a back plate disposed on the support substrate and opposite to the vibratable membrane. The suspended portion has an edge extending substantially along with an edge of an opening of the recess. The suspended portion is separated from the first portion and the second portion of the upper surface by an inner interval and an outer interval, respectively.

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Tainan, Taiwan

Chin-Fu Kuo