Primax Electronics Ltd.

Lite-on Technology Corporation

Lite-on Electronics (guangzhou) Limited

Chin-Ding Lai

Han-Kai Wang

Yong-De Huang

Meng-Long Wu

Ta-Sheng Yu

A camera module includes a substrate, a sensing chip, a lens module and a piezoelectric plate. The sensing chip is electrically connected with the substrate. The sensing chip includes a sensing region. The sensing chip is covered by the lens module. The sensing chip is arranged between the substrate and the lens module. When an external light beam passes through the lens module and projected on the sensing region, the sensing chip generates an image. The piezoelectric plate is arranged between the substrate and the lens module. When an electric power is provided to the piezoelectric plate, the piezoelectric plate is subjected to deformation, so that the lens group focuses on the sensing region. The present invention also provides a calibration method for the camera module.

Camera module and calibration method thereof

An assembling method is provided for assembling a camera module with a substrate and a lens module includes the following steps. In a step (A), a sensing chip is installed on a surface of the substrate. In a step (B), a fixture is assembled with the substrate, wherein plural inner walls of the fixture are arranged around at least a lateral edge of the substrate. In a step (C), a glue is coated on a periphery of the surface of the substrate, wherein a movable range of the glue is limited by the plural inner walls of the fixture. In a step (D), a lens holder of the lens module is installed on the surface of the substrate, so that the lens holder and the substrate are combined together through the glue. In a step (E), the fixture is separated from the substrate.

Assembling method of camera module

A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.

Camera module and assembling method thereof

A wireless audio-video (AV) transmission module is to be disposed in an AV source device. The AV source device includes an AV source unit for generating an AV signal. The wireless AV transmission module includes a video scaler unit and a wireless transmission unit. The video scaler unit is to be coupled electrically to the AV source unit, upscales a video signal of the AV signal from the AV source unit, and outputs an upscaled AV signal including the upscaled video signal. The wireless transmission unit is coupled electrically to the video scaler unit and wirelessly transmits the upscaled AV signal that includes the upscaled video signal.

Growing community of inventors

Taipei, Taiwan

Chin-Ding Lai