Asustek Computer Inc.

National Taiwan University

Primax Electronics Ltd.

Chin-Chuan Wu

Wei-Chia Liao

Wen-Ting Yu

Wei-zhen Wu

Kuan-Chuan Wang

Nai-Cheng Chou

Yi-Min Hsu

Neng-chung Hu

Yi-Hong Lin

A heat dissipation module is adapted for being installed on a circuit board. The heat dissipation module includes a fixed base and a heat dissipating device. One end of the fixed base is adapted for being fixed to the circuit board, and the other end has a rotating component. The rotating component is pivoted on the fixed base along a rotation axis. The heat dissipation device includes a heat dissipation body and an alignment member extending from the heat dissipation body, and the alignment member is adapted to be detachably connected to the rotating component. When the heat dissipation device is connected to the rotating component through the alignment member, the heat dissipation body is adapted to flip relative to the fixed base along the rotating axis.

Heat dissipation module

A circuit board is adapted for inserting an expansion card with an electrical contact part, a non-electrical convex part, and a positioning part. The circuit board includes a board body, a slot, a release structure, and a transmission mechanism. The slot is disposed on the board body and includes a socket, a connecting end, and an outer surface. The socket is adapted for the electrical contact part to be inserted. The release structure is movably disposed at the connecting end and includes a limiting part. The transmission mechanism is disposed in the socket, adjacent to the connecting end, or adjacent to the outer surface. The transmission mechanism includes a driving member and a linking member. The driving member is adapted for contacting the electrical contact part, the non-electrical convex part, or the positioning part. The linking member is disposed between the driving member and the release structure.

Circuit board

A processing process of a multi-lens camera module includes the following steps. Firstly, a first lens module and a first photosensitive element are installed on a first circuit board, and the first circuit board is fixed on a casing. Then, a second lens module and a second photosensitive element are installed on a second circuit board, and a bottom glue is coated on a lower portion of the second lens module. Then, the second lens module is adhered onto the casing through the bottom adhesive. After an optical axis parallel adjustment process is performed, the second lens module is in parallel with the first lens module. Then, a top glue is coated on an upper portion of the second lens module. After a baking process is performed, the top glue and the bottom glue are cured completely.

Multi-lens camera module and assembling process thereof

The present invention discloses a lighting lamp (), is used for emitting a plurality of lights with different color temperatures, and color rendering indexes of all the lights are larger than 90. The lighting lamp () includes a combination () of light sources and a driving module (). The combination () of the light sources includes four LEDs with specific wavelengths. The driving module () is utilized to drive the LEDs to illuminate and to control energy distribution of luminous energy for the first, second, third and fourth LEDs, thereby dynamically adjusting to show the light with 9000K, 12000K and eight color temperatures defined by the ENERGY STAR.

Lighting lamp

Growing community of inventors

Taipei, Taiwan

Chin-Chuan Wu