Industrial Technology Research Institute

Chin Chiu Hsia

Bing-Yue Tsui

Tsung-Ju Yang

Tsung Yao Chu

Yen-Chung Huang

Yu-Te Kao

An output stage circuit comprises: a power inverter, coupled to a signal terminal; and a dynamic bias circuit, wherein the dynamic bias circuit connects between a system voltage terminal and the power inverter. The dynamic bias circuit comprises at least one Zener diode, which is configured to maintain a voltage difference between a gate terminal and a source terminal of at least one transistor of the power inverter within a first absolute value; which is configured to maintain a voltage difference between the gate terminal and a drain terminal of the at least one transistor within a second absolute value; and configured to maintain a voltage difference between the drain terminal and the source terminal of the at least one transistor within the second absolute value.

Output stage circuit

An ultrasound transmission circuit comprises a pulse generating circuit, a feedback circuit and a processing circuit. The feedback circuit outputs a trigger signal according to a first pulse signal arriving at an ultrasound transducer. The processing circuit records a first time point at which the first pulse signal is generated, and records a second time point at which the first pulse signal arrives the ultrasound transducer according to the trigger signal. The processing circuit adjusts a first delay value according to a variance between the first time point and the second time point to generate a second delay value, and drives the pulse generating circuit according to the second delay value to generate a second pulse signal.

Ultrasound transmission circuit and time delay calibration method thereof

A bonding pad that has low parasitic capacitance and that transmits little or no stress to the underlying metal layer during bonding, along with a process for manufacturing it, is described. A key feature of this structure is that the damascene wiring directly below the bonding pad has been limited to its outer edges, that is it is formed in the shape of a hollow square. This limits overlap by the aluminum pad of the damascene wiring to the via hole area only. After a passivation layer, including suitable diffusion barriers, has been laid over the structure, it is over-filled with a suitable soft metal (typically copper or one of its alloys) and then planarized in the usual way. A via hole for communicating with the damascene wiring is then formed. This via can take the shape of a somewhat smaller hollow square or it can be formed from a series of individual vias arranged in the shape of a broken hollow square.

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Taipei, Taiwan

Chin Chiu Hsia