Innolux Corporation

Chin-Cheng Kuo

Chia-Chun Yang

Wen-Cheng Huang

Ting-Sheng Chen

Chien-Chih Chen

Chih-Jen Chang

Chih-Chiao Yang

Hsin-Tien Wu

Tong-Jung Wang

Jia-Sin Li

Li-Ling Chen

An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

Electronic device

An electronic device is provided. The electronic device includes a frame, a working panel, a case, and an adhesive material. The frame includes a side wall and a back plate. The working panel is disposed on the back plate. The case is disposed on the frame and adjacent to the working panel. The adhesive material is disposed on the case. The side wall has an outer surface facing away from the working panel. In a cross-section view of the electronic device, a portion of the adhesive material is in contact with the outer surface of the side wall of the frame, and a length of the adhesive material is greater than or equal to 50% of a length of the side wall of the frame along an extension direction.

An electronic device is provided. The electronic device includes a frame, a backlight module, a working panel, and a spacer. The backlight module is disposed in the frame. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

A display device includes a first substrate, a second substrate, a plurality of drive ICs and at least one flexible circuit board. The first substrate has a first region and a second region near to the first region. The second substrate is disposed on the first region and has a lateral side. The plurality of drive ICs are disposed on the second region and arranged along the lateral side. The at least one flexible circuit board is disposed on the second region and disposed correspondingly to the lateral side. Wherein in a top view of the display device, each of the plurality of drive ICs does not overlap with the at least one flexible circuit board in a direction perpendicular to an extending direction of the lateral side.

Display device

An electronic device is provided, including a frame, a working panel, and a spacer. The frame includes a side wall. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

An electronic device is provided, including a frame, a backlight module, a working panel, and a tape. The frame includes a side wall and a back plate. The side wall includes an outer surface. The extension direction of the back plate is different from the extension direction of the side wall. The backlight module is disposed on the back plate. The working panel and the back plate are disposed on the opposite sides of the backlight module. The tape is in contact with at least a portion of the outer surface and the working panel.

A display device is provided. The display device includes a display panel that has a polarizer, a light source assembly, a first spacer, and a second spacer. The first spacer is disposed on the first side of the display panel near the light source assembly. The first spacer is located between the display panel and the light source assembly. The second spacer is disposed on the second side of the display panel, away from the light source assembly. The thickness of the first spacer is different than that of the second spacer.

Display devices

A manufacturing method of a display device is disclosed. The method includes the following steps. A first substrate having a first region and a second region is provided. A second substrate is disposed on the first substrate. The second substrate is overlapping the first region. At least one drive IC is disposed on the second region. A protection layer is disposed on the second region. The protection layer is disposed enclosing the at least one drive IC. The protection layer has a maximum height larger than a maximum height of the at least one drive IC.

Manufacturing method of a display device

An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.

A display device includes a display panel, a light shielding unit and a back plate. The display panel includes a first substrate, a second substrate and an upper polarizer. The first substrate is disposed corresponding to the second substrate. The upper polarizer is disposed on the second substrate. The light shielding unit is connected to the upper polarizer. The first substrate is disposed on the back plate.

A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.

A display device includes a display panel, a first frame, a second frame and an adhesive element. The first frame is disposed corresponding to the display panel and includes a bottom portion and a side wall. The bottom portion is connected to the side wall. The second frame is disposed on the first frame. The display panel is disposed on a part of the second frame. The adhesive element is disposed between the first frame and the second frame. The adhesive element contacts at least a part of the bottom portion and at least a part of the side wall. An assembling method of the display device is also provided.

Display device and assembling method thereof

A display module is provided. The display module includes a backlight module with an upper surface, a display panel opposite to the backlight module, and a glue having a first contact surface and a second contact surface located between the display panel and the backlight module, wherein the first contact surface is in contact with the display panel, the second contact surface is in contact with the upper surface of the backlight module, and there is a gap between the display panel and the backlight module. A method for fabricating a display module is also provided.

Display modules and method for fabricating the same

A display device and a method for preparing the same are disclosed. The display device includes a display panel and a backlight module. The backlight module is located below the display panel and includes a back plate, a first adhesive layer, a light emitting module and a reflector. The first adhesive layer is disposed on the back plate and the first adhesive layer includes a first area and a second area. The first area is adjacent to the second area. The light emitting module includes a light emitting unit and a print circuit board. The light emitting unit and the print circuit board are electrically connected, and the print circuit board is disposed in the first area of the first adhesive layer. A part of the reflector is disposed in the second area of the first adhesive layer.

Display device and method for preparing the same

A display device includes a display panel, a light shielding unit, a supporting unit, and a backlight module. The display panel includes a first substrate and a first polarizer. The first substrate has a first surface, and the first surface has a first active area and a first non-active area. The first non-active area is disposed adjacent to the first active area, and the first polarizer is disposed on the first active area. The light shielding unit is disposed on the first non-active area and connected to the first polarizer. The supporting unit is disposed corresponding to the light shielding unit. The backlight module is disposed corresponding to the display panel and includes an optical film. The supporting unit is disposed between the light shielding unit and the optical film, and contacts the light shielding unit and the optical film.

Growing community of inventors

Miao-Li County, Taiwan

Chin-Cheng Kuo