Advanced Chip Engineering Technology, Inc.

Industrial Technology Research Institute

Chin-Chen Yang

Wen-Kun Yang

Wen-Bin Sun

His-Ying Yuan

Jui-Hsien Chang

Shan-Chang Chueh

Yu-Chi Lee

Hong-Yu Lin

Chun-Hui Yu

Chao-Nan Chou

Kuang-Chi Chao

Cheng-hsien Chiu

Chun Hui Yu

Kou-Chang Su

Ting-Huey Chiou

Wen-Ping Yang

Fang-I Shieh

An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.

Image sensor with a protection layer

A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

FBGA and COB package structure for image sensor

A method for forming a compact LCD package and devices formed by such method are disclosed. In the method, an LCD display panel is formed by bonding an upper glass panel and a lower glass panel together and exposing an edge portion formed by a larger lower glass panel. Conductive traces formed of a conductive film layer such as ITO is provided on the edge portion of the LCD display panel for providing electrical connection to the drive lines and scan lines for the LCD panel. A two-step bonding method is used to first bond a printed circuit board in a pre-bonding step to the exposed edge portion of the LCD panel by using an anisotropic conductive film layer. The bonding is conducted under pressure and heat such that electrical communication is established through the conductive metal particles contained in the anisotropic conductive film. In a second, or post-bonding step, an IC chip or a driver chip is bonded to the top of the PCB by a multiplicity of solder bumps formed on the driver chip connecting electrically to a second multiplicity of conductive pads formed on top of the PCB substrate. The present invention novel method therefore produces a more compact LCD package which saves a planar area in an edge portion by at least 50%. In the first pre-bonding method that utilizes an anisotropic conductive film, fabrication equipment for an outer lead bonding method can be utilized. In the post-bonding step, fabrication equipment for an inner lead bonding method can be used.

Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB

A process for making high-quality foamed aluminum articles is disclosed. This process comprises the step of: (a) placing a raw aluminum feedstock into a mold, the raw aluminum feed stock contains at least 50 wt % spent (i.e., recycled) aluminum and does not contain any extraneous viscosity enhancing agent such as metallic calcuim or magnesium; (b) heating the mold so as to melt the raw aluminum feedstock to form a liquid aluminum mass; (c) stirring the liquid aluminum mass in open air to increase its viscosity by a factor of at least about 1.3 to 1.8; (d) adding a foaming agent into the liquid aluminum mass; (e) continuing stirring the liquid aluminum mass containing the foaming agent so as to generate and uniformly distribute gas bubbles inside said liquid aluminum mass; and (f) cooling and solidifying the liquid aluminum mass to room temperature so as to form the foamed aluminum article. In a preferred embodiment, recycled foamed aluminum materials are used as the raw aluminum feedstock. The foamed aluminum article has a porosity of at least 80%, a specificity density of no greater than 0.45, and an average pore size between 3 and 6 min. Because the process is self-thickening, and no extraneous thickeners such as calcium metal are needed, great economic benefits can be obtained without adversely affecting the quality of the final product.

Method for manufacturing environmentally conscious foamed aluminum

Growing community of inventors

Taipei, Taiwan

Chin-Chen Yang