Au Optronics Corporation

Chin-Chen Yang

Ke-Feng Lin

Chih-Sung Wang

Hui-Chang Chen

I-Ming Liu

Hong-Shiung Chen

Ping-Chin Cheng

Feng-Cheng Su

Sheng-Hsiung Ho

Wen-Chih Yang

Shan-Te Chen

Sheng-Lun Su

A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.

Reel-type package of flexible printed circuit boards and method for supplying thereof

A liquid crystal display module includes a substrate, one or more first leads, one or more shorting bars. one or more second leads and one or more cutting traces. The first leads and the shorting bars are disposed over the substrate. The shorting bars are adjacent to the first leads and electrically connected to the first leads via one or more connecting lines. The second leads are mounted with the first leads respectively and are electrically connected to the corresponding first leads. The cutting traces are used for electrically disconnecting the first leads from the shorting bars. A laser beam is used to cut off the connecting lines along the cutting trace after the liquid crystal display module has been tested, so that the short bar is electrically disconnected from the first leads, and a disconnecting point is formed on the intersection of the each cutting trace and connecting line.

Liquid crystal display module

A bump layout on the active region of a driver IC for increasing overall bump count. The layout fits IC packages that have a narrow and long body profile. Bumps are positioned close to the long side and central regions of the active region so that low marking pressure on the shorter sides of the package during chip-glass bondage is avoided. Dummy bumps may also be positioned close to the shorter sides of the package so that pressure distribution is optimized during chip-glass bondage.

Bump layout on silicon chip

A display panel comprises the following elements. A pixel array arranged by a plurality of pixel devices is applied for producing images according to input signals. A plurality of COG chips are fabricated on a peripheral region of the display panel and connected in series wherein the COG chips can convey the input signals to the pixel array for driving selected the pixel devices. A plurality of WOA lines are defined on the display panel for connecting the COG chips in series to transfer the input signals. And a first bypassing bus is fabricated aside the COG chips and connected separately to two different WOA lines for connecting with at least one the COG chip in parallel so as to bypass the input signals.

Display panel with bypassing lines

A plurality of metal bumps connecting a nonconducting substrate and a chip, consisting of: at least a first metal bump having at least one curved face, at least a second metal bump having at least one curved face, and at least a third metal bump having at least a first curved face and a second curved face. The three centers of these first three metal bumps form a triangle, in that the first curved face of the third metal bump is adjacent to the curved face of the first metal bump, and the second curved face of the third metal bump is adjacent to the curved face of the second metal bump.

Growing community of inventors

Chupei, Taiwan

Chin-Chen Yang