Samsung Electronics Co., Ltd.

Chil Woo Kwon

Sung Uk Lee

Sung Hoan Kim

Chang Eun Joo

Young Kyu Lim

Gyu Jin Choi

A semiconductor package includes: a semiconductor chip including a body having a first surface and a second surface, opposing the first surface, a connection pad disposed on the first surface of the body, and an extension pad disposed on the connection pad; and a connection structure including an insulating layer disposed on the first surface of the body of the semiconductor chip, a redistribution via penetrating through the insulating layer and having one side thereof in contact with the extension pad, and a redistribution layer disposed on the insulating layer and having a via pad in contact with the other side of the redistribution via, wherein a horizontal cross-sectional area of extension pad of the semiconductor chip is greater than a horizontal cross-sectional area of the connection pad of the semiconductor chip.

Growing community of inventors

Suwon-si, South Korea

Chil Woo Kwon