Samsung Electronics Co., Ltd.

Chil-Nam Yoon

Jae-jun Lee

Young-Jun Park

Young-Man Ahn

Byung-Se So

Do-hyung Kim

Jung-Joon Lee

Sung-joo Park

Ki-Hyun Ko

Kwang-Seop Kim

Hui-chong Shin

Seon-Ryeong Kang

Il-Sung Yu

A memory module includes a plurality of semiconductor memory devices and a circuit board. The circuit board is electrically connected to the plurality of semiconductor memory devices, and a signal line is disposed in the outermost layer of the circuit board. An electrical reference for the signal line is provided in a layer of the circuit board that is not adjacent to the outermost layer. Accordingly, an impedance of the signal line may be increased, and signal integrity of a signal transmitted through the signal line may be improved.

Printed circuit board and memory module including the same

A memory module includes a first memory group including a plurality of memory devices, a second memory group including a less number of memory devices with respect to the memory devices in the first memory group, a register configured to provide a command/address signal to the first memory group and a delayed command/address signal to the second memory group, a first signal line configured to transfer the command/address signal to the first memory group, and a second signal line configured to transfer the delayed command/address signal to the second memory group.

Memory module and register with minimized routing path

The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sodes which same signal applying balls of the memory chips contact in the mirror form, wherein a via is formed at a location close to the same signal applying contact pad of one side among the same signal applying contact pads arranged on both sides in the mirror form, the via connecting the other side to the signal line of one side, and a signal transmitted from the other side is connected to a contact junction, the contact junction is connected to the same signal applying contact pad of the other side, the contact junction is connected to the via of the other side, and the via of one side is connected to the same signal applying contact pad of one side.

Memory module and signal line arrangement method thereof

The present invention discloses a memory module and a method of arranging a signal line of the same. The method of arranging a signal line of a memory module comprises: classifying a plurality of memories into a first group including an odd number of memories and a second group including an even number of memories; arranging first branch points corresponding to the plurality of memories and respectively connecting the first branch points to the plurality of memories through first signal lines; arranging a second branch point located at a middle of the second group for respectively connecting between the first branch points adjacent to each other of the second group and between the first branch points adjacent to the second branch points and the second branch point through second signal lines; arranging a third branch point located at a middle of the second group, receiving an external signal, and connecting the third branch point and the second branch point of the second group through a third signal line; and connecting between the second branch point of the second group and the first branch point of the first group through a fourth signal line.

Memory module and a method of arranging a signal line of the same

Growing community of inventors

Suwon-si, South Korea

Chil-Nam Yoon