Fujitsu Corporation

Chikayuki Kumagai

Kenichiro Abe

Kiyotaka Seyama

Seiichi Saito

Akiyoshi Saitou

Toshinari Hayashi

Takeshi Midorikawa

Toru Kuraishi

Masashi Fujimoto

A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.

Buildup board, and electronic component and apparatus having the buildup board

A massive bus bar for supplying a determined power voltage to a circuit component mounted on a rigid circuit board having a conductor layer connecting the component to a bus bar connecting pad formed on the surface of the board. Plurality of first notches extend through a main surface of the bus bar from a common longitudinal edge, perpendicularly to the longitudinal axis of the bus bar and throughout the full longitudinal extent of the bus bar, and define a plurality of posts which are secured at their bottom surfaces to the conductive pads on the circuit board surface. The first notches facilitate flexing of the bus bar and reduce stresses otherwise produced due to the rigid connection of the bus bar to the circuit board, while not significantly diminishing the current handling capability of the bus bar. Second and third pluralities of orthogonally extending notches, respectively parallel and perpendicular to the longitudinal axis of the bus bar, are formed in the bottom surfaces of each post, further reducing stresses.

Bus bar for a circuit board

Growing community of inventors

Kawasaki, Japan

Chikayuki Kumagai