Disco Corporation

Chikara Aikawa

Yoshiaki Yodo

Hirokazu Matsumoto

Yuki Ogawa

Kunimitsu Takahashi

Nobuyasu Kitahara

Junichi Kuki

Jun Abatake

Hiroto Yoshida

Yasuyoshi Yubira

Seiji Fujiwara

A laser processing apparatus includes a melt processing unit for processing a melt formed by laser processing, the melt processing unit being disposed downstream of a condenser in a laser beam irradiating direction. The melt processing unit includes a gas injecting section having an opening allowing the passage of a laser beam applied from the condenser, the gas injecting section injecting high-speed gas from the opening to a workpiece, and a melt sucking section having a suction port disposed so as to surround the opening of the gas injecting section, the suction port sucking the melt scattered by the high-speed gas injected from the opening. The gas injecting section is connected to high-pressure gas supply source, and the melt sucking section is connected to melt sucking unit.

Laser processing apparatus

A wafer processing method divides a wafer into a plurality of individual devices along a plurality of crossing division lines formed on the front side of the wafer. The method includes a functional layer removing step of applying a COlaser beam to the wafer along each division line with the spot of the COlaser beam, having a width corresponding to the width of each division line set on the upper surface of each division line, thereby removing a functional layer along each division line to form a groove along each division line where the functional layer has been removed, and a groove shaping and debris removing step of applying a laser beam having a wavelength in the ultraviolet region to the wafer along each groove, thereby removing debris sticking to the bottom surface of each groove and also shaping the side walls of each groove.

Wafer processing method

A wafer dividing apparatus for dividing a wafer along a plurality of crossing streets in the condition where the wafer is attached to the upper surface of a dicing tape supported to an annular frame and the strength of the wafer is reduced along the streets. The wafer dividing apparatus includes a frame holding unit for holding the annular frame, a wafer holding table having a holding surface for holding the wafer through the dicing tape supported to the annular frame held by the frame holding unit, a tape expanding unit for relatively moving the frame holding unit and the wafer holding table in a direction perpendicular to the holding surface of the wafer holding table to thereby expand the dicing tape, and a vibration generating unit for applying vibration to the holding surface of the wafer holding table.

Wafer dividing apparatus and laser processing apparatus

Growing community of inventors

Tokyo, Japan

Chikara Aikawa