Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Chihshun Tang

Lijun Qin

The present application provides a display device. The display device includes a display panel, an adhesive layer, and a heat dissipation buffer layer. The adhesive layer in the present application is arranged between a display portion and a bonding portion. The heat dissipation buffer layer is arranged at one side of the display portion of the display panel facing the bonding portion. A projection of the heat dissipation buffer layer projected on the display portion does not overlap a projection of the adhesive layer projected on the display portion.

Display device

A flexible display module is provided. The flexible display module includes a bending area and a plane area adjacent to the bending area, and the flexible display module includes a flexible display panel; a protection cover plate; and a transparent adhesive layer, wherein the transparent adhesive layer bonds the flexible display panel and the protection cover plate, and storage modulus of at least a part of the transparent adhesive layer corresponding to the bending area is less than storage modulus of at least a part of the transparent adhesive layer corresponding to the plane area.

Flexible display module

The present application provides a display panel and a display device. The display panel includes a panel main body and a heat dissipation layer disposed on one side of the panel main body. The panel main body includes a first body portion. The heat dissipation layer includes a first heat dissipation portion corresponding to the first body portion. A surface of the first heat dissipation portion on one side away from the panel main body is a non-flat surface, so that a contact area of the heat dissipation layer with an outside of the display panel is increased, to avoid display abnormalities on the display panel due to poor heat dissipation.

Display panel and display device

The present invention provides a display module and a display device. By disposing a second heat dissipation layer between a first heat dissipation layer and a first substrate, and connecting the first heat dissipation layer with the second heat dissipation layer, heat in a driving chip is transmitted to the second heat dissipation layer and then directly transmitted to the first heat dissipation layer, thereby the display module allows the heat to be quickly distributed throughout the panel and reducing the temperature in the areas corresponding to the driving chip. Therefore, the present invention solves the technical problem that areas corresponding to driving chips have higher temperature when current display modules are in operation.

Growing community of inventors

Wuhan, China

Chihshun Tang