Renesas Electronics Corporation

Denso Corporation

Nec Electronics Corporation

Chiho Ogihara

Koji Kondo

Ryuichi Oikawa

Tomohiro Yokochi

Ryohei Kataoka

Akimori Hayashi

Katsunobu Suzuki

Tadashi Murai

Makoto Nakagoshi

Naoko Sera

A semiconductor apparatus includes: a wiring board; a lid; and gap filling resin. A semiconductor chip is mounted on the wiring board. The lid includes inlet portions for injecting resin. The semiconductor chip is covered with the lid on the wiring board. The gap filling resin bonds the wiring board and the lid inside the lid.

Semiconductor package with lid bonded on wiring board and method of manufacturing the same

A substrate includes a base material, a first solder part disposed on a surface of the base material and used for connection to an electronic component, and a second solder part disposed on the surface of the base material and made of the same solder as that of the first solder part. The top surface of the first solder part is made to be a flat surface, and the maximum height of the second solder part from the surface of the base material is lower than the height of the flat surface of the first solder part from the surface of the base material. Thus, a substrate for which the kind of solder can be determined easily and with certainty, a device provided with this substrate, a method of manufacturing the substrate, and a determining method are provided.

Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method

A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

Growing community of inventors

Kanagawa, Japan

Chiho Ogihara