Nippon Kayaku Kabushiki Kaisha

Oki Electric Industry Co., Ltd.

Oki Data Corporation

Chihiro Takahashi

Kenichi Tanigawa

Shinya Jyumonji

Takuma Ishikawa

Hiroto Kawada

Takahito Suzuki

Kouichi Tanaka

Toru Kosaka

Yusuke Nakai

Hironori Furuta

Tomoyuki Hayasaki

Yuuki Shinohara

Yukihiro Hara

Yoshiyuki Yahagi

Michiharu Arifuku

Yoshihiko Taira

Hideomi Sakai

Hitoshi Asami

Yui Yokoyama

Genichirou Matsuo

Genichiro Matsuo

A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.

Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof

A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.

Composite integrated film, composite integrated film supply wafer, and semiconductor composite device

The present disclosure relates to an optical film includes (A) an optical functional layer and (B) a block layer, and (B) the block layer has a cured product of a resin composition containing (B-1) a thermoplastic resin and (B-2) an ultraviolet curable resin.

Optical film, optical laminate, functional glass, and head-up display

A light-emitting thyristor includes a first semiconductor layer of a P type, a second semiconductor layer of an N type arranged adjacent to the first semiconductor layer; a third semiconductor layer of the P type arranged adjacent to the second semiconductor layer; and a fourth semiconductor layer of the N type arranged adjacent to the third semiconductor layer. A part of the first semiconductor layer is an active layer adjacent to the second semiconductor layer. A dopant concentration of the active layer is higher than or equal to a dopant concentration of the third semiconductor layer. A thickness of the third semiconductor layer is thinner than a thickness of the second semiconductor layer. A dopant concentration of the second semiconductor layer is lower than the dopant concentration of the third semiconductor layer.

Light-emitting thyristor, light-emitting element chip, optical print head, and image forming device

A light-emitting thyristor includes a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type arranged adjacent to the first semiconductor layer; a third semiconductor layer of the first conductivity type arranged adjacent to the second semiconductor layer; and a fourth semiconductor layer of the second conductivity type arranged adjacent to the third semiconductor layer. The first semiconductor layer includes an active layer adjacent to the second semiconductor layer, the second semiconductor layer includes a first layer adjacent to the active layer and a second layer arranged between the first layer and the third semiconductor layer, and the first layer has a band gap wider than a band gap of the active layer and a band gap of the second layer.

Light-emitting thyristor, light-emitting element chip, optical print head, and image forming apparatus

An optical laminate structure includes a light control laminate having at least one light reflection layer, a first quarter wave plate laminated on one of surfaces of the light reflection layer, and a second quarter wave plate laminated on another surface of the light reflection layer. The light reflection layer includes a right-handed circularly polarized light reflection layer or a left-handed circularly polarized light reflection layer, and an angle formed by a polarization axis of the S-polarized light or P-polarized light incident from a position inclined from an axis perpendicular to a surface of the light control laminate by 45&#xb0; or more and 65&#xb0; or less and a slow axis of the first quarter wave plate on a side to which the S-polarized light or P-polarized light is incident is 5&#xb0; or more and less than 45&#xb0;.

Optical laminate structure and head-up display system using the optical laminate structure, and light reflection film

A light controlling film comprises a light reflecting film and a light controlling layer that are laminated. The light reflecting film comprises at least two laminated light reflecting layers including at least one of light reflecting layers PRL-to PRL-that a central reflection wavelength of 400 nm-500 nm, 500 nm-600 nm, and 600 nm-700 nm, respectively, and a reflectance to ordinary light at the central reflection wavelength of 5%-25%. The at least two light reflecting layers have central reflection wavelengths that are different from each other. All of the at least two laminated light reflecting layers have a property of reflecting polarized light having the same orientation. The light controlling layer comprises two quarter wave plates, and the light reflecting film is laminated so as to be interposed between the two quarter wave plates.

Light reflecting film, and light controlling film, optical film, functional glass and head-up display including the light reflecting film

[Problem] The present invention relates to: a heat ray shielding adhesive which is used in bonding to a windowpane and the like and shields heat rays; a heat ray shielding transparent adhesive sheet; and a method for producing the heat ray shielding adhesive. The present invention provides a heat ray shielding transparent adhesive sheet which has high transmittance in the visible light region, low haze and more excellent transparency. [Solution] Transparency and heat ray shielding properties can be imparted in a simpler manner by using a heat ray shielding adhesive composition which contains fine heat ray shielding particles that have a half-value width of the first main peak of from 0.01&#xb0; to 0.80&#xb0; (inclusive) as determined by X-ray diffraction pattern, and a heat ray shielding transparent adhesive sheet is therefore able to be produced at low cost.

Heat ray shielding adhesive composition, heat ray shielding transparent adhesive sheet, and method for producing same

Growing community of inventors

Tokyo, Japan

Chihiro Takahashi