Kuraray Co., Ltd.

Chihiro Okamoto

Mitsuru Kato

Shinya Kato

Minori Takegoshi

Hirofumi Kikuchi

Azusa Oshita

Kiyofumi Kadowaki

Shunji Kaneda

Shunro Taniguchi

There is used a polyurethane for polishing layers that can be used as a material of a polishing layer of a polishing pad, the polyurethane including a thermoplastic polyurethane that is a reaction product of a polyurethane raw material including a polymer diol, an organic diisocyanate, and a chain extender, wherein the chain extender contains 50 mass % or more of a first chain extender including a straight-chain carbon backbone having 7 to 12 carbon atoms.

Polyurethane for polishing layer, polishing layer, and polishing pad

Disclosed are a polyurethane for use in a polishing layer, and a polishing layer and a polishing pad using the same, the polyurethane including a terminal group represented by the following formula (I): R—(OX)— (I) wherein R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that may be substituted with a heteroatom or may be interrupted by a heteroatom, X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and n represents a number from 8 to 120.

Polyurethane for polishing layers, polishing layer and polishing pad

Disclosed is a polishing pad including a polishing layer having a polishing surface, wherein the polishing surface includes a deep-groove region having a first pattern formed by a deep groove or hole having a depth of 0.3 mm or more, and a land region that is a region other than the deep-groove region, and the land region includes shallow recesses having a second pattern and a depth of 0.01 to 0.1 mm, and a plurality of island-like land portions surrounded by the shallow recesses and having a maximum distance in a horizontal direction of 8 mm or less.

Polishing pad, method for manufacturing polishing pad, and polishing method

A modification method of a polyurethane, including the steps of: preparing a polyurethane having an ethylenically unsaturated bond; and treating the polyurethane with a liquid containing a compound having a conjugated double bond, or a modification method of a polyurethane, including the steps of: preparing a polyurethane having a conjugated double bond; and treating the polyurethane with a liquid containing a compound having an ethylenically unsaturated bond is used.

Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad

A Schiff base-containing chain extender may be a diol having a Schiff base or a derivative thereof, as well as a polyurethane produced using the same and a modification method thereof, and a polishing layer including a polyurethane and a polishing method using the polishing layer.

Polyurethane for polishing layer, polishing layer including polyurethane and modification method of the polishing layer, polishing pad, and polishing method

Provided is a polishing pad including a polishing surface having a zeta potential of +0.1 mV or more at a pH of 10.0. Preferably, a polishing pad including a polyurethane having a tertiary amine is provided. Further preferably, the polyurethane having a tertiary amine is a reaction product of a polyurethane reaction raw material containing at least a chain extender having a tertiary amine. A polishing method using the polishing pads is also provided, wherein the method is performed while supplying an alkaline polishing slurry.

Polishing pad and polishing method using same

Disclosed herein are polyurethanes useful for polishing layers, where the polyurethane is a polyurethane having a Schiff base. Also disclosed herein are polishing layers containing the polyurethanes, polishing methods that use the polishing layers, and a modification method including a step of converting the Schiff base into at least one functional group selected from an aldehyde group, a carboxylic acid group, a hydroxyl group, and an amino group.

Disclosed is a non-porous molded article for a polishing layer, the non-porous molded article including a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a maximum value of a loss tangent (tan &#x3b4;) in a range of &#x2212;70 to &#x2212;50&#xb0; C. of 4.00&#xd7;10or less. Preferably, the thermoplastic polyurethane is obtained by polymerization of a polymer diol having a number average molecular weight of 650 to 1400, an organic diisocyanate, and a chain extender, and a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate is 5.7 to 6.5 mass %.

Non-porous molded article for polishing layer, polishing pad, and polishing method

Disclosed is a polishing-layer molded body including: a thermoplastic polyurethane that is a polymer of a monomer including: a polymer diol; an organic diisocyanate; a first chain extender including a diol having 4 or less carbon atoms; a second chain extender including a diol having 5 or more carbon atoms, a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate being 6.3 to 7.4 mass %, and the polishing-layer molded body being non-porous.

Polishing-layer molded body, and polishing pad

The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.

Slurry for chemical mechanical polishing and polishing method for substrate using same

The present invention provides a slurry for chemical mechanical polishing, containing abrasive grain (a), compound (b) having an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water.

Slurry for chemical mechanical polishing and chemical mechanical polishing method

The subject is to provide a polymer material which enables to improve planarity and planarization efficiency of a polished surface and is useful as a polishing pad which generates only a few scratches. The said subject is solved by a polymer material having a tensile modulus at 50&#xb0; C. after saturation swelling with 50&#xb0; C. water of 130 to 800 MPa, a loss tangent at 50&#xb0; C. of not more than 0.2, and a contact angle with water of not more than 80&#xb0;.

Polymer material, foam obtained from same, and polishing pad using those

The invention provides a polishing pad to polish a metal layer. The polishing pad has a storage elastic modulus at 80&#xb0; C. of 200 to 900 MPa and a storage elastic modulus at 110&#xb0; C. of 40 MPa or less. The invention also provides a method of polishing a metal layer using the pad.

Metal film polishing pad and method for polishing metal film using the same

The present invention aims to provide a polyurethane foam, suitably usable as a polishing pad, having a uniform foam structure, which can achieve the improvements in the flatness of the surface of polished materials and in the planarization efficiency, and can extend the polishing pad life longer than that of the conventional polyurethane foams. This aim can be achieved by providing a polyurethane foam having a density of 0.5 to 1.0 g/cm, a cell size of 5 to 200 &#x3bc;m and a hardness [JIS-C hardness] of not less than 90, comprising a thermoplastic polyurethane which is obtained by a reaction of a high polymer polyol, an organic diisocyanate and a chain extender, contains not less than 6% by weight of a nitrogen atom derived from the isocyanate group, and has a storage elastic modulus measured at 50&#xb0; C. [E'] of not less than 5&#xd7;10dyn/cm.

Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam

(A) A polyester resin composition comprising a copolymerized polyethylene terephthalate (copolymerized PET) comprising 5 to 40 mole % of naphthalenedicarboxylic acid units, a cobalt compound and/or a manganese compound, an olefin polymer and a compatibility-improving agent, in specific amounts; and (B) a polyester resin composition comprising the above copolymerized PET which contains specific amounts of both a cobalt compound and a manganese compound are excellent in resistance to hydrogen peroxide, flavor-barrier properties, gas-barrier properties, heatsealability and mechanical properties such as elongation and strength and, utilizing these features, are effectively usable for various end-uses in particular as packaging materials for beverages such as fruit juices containing flavor components.

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Kurashiki, Japan

Chihiro Okamoto