Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Chihiro Igarashi

Yasuhiro Okada

Toshihiko Tsujikawa

Nobuhisa Watanabe

Tomotaka Nishimoto

Takanori Yoshitake

A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after completion of predetermined work performed on all the substrates transferred to the tape attaching unit, the component mounting unit, and the component compression unit, respectively. When preparation for transferring the substrates to the tape attaching unit is not completed within a predetermined time after the start of measurement performed by the time measuring unit, the respective substrates, which wait in the tape attaching unit, the component mounting unit, and the component compression unit, are forcibly transferred to the downstream sides and predetermined work is performed on the respective substrates that are forcibly transferred to the component mounting unit and the component compression unit.

Component mounting apparatus

A component mounting apparatus includes a tape attaching unit, a component mounting unit and a component compression unit provided in this order. A time measuring unit measures time having passed after attachment of the adhesive tape in the tape attaching unit. When a predetermined time has passed after the start of measurement performed by the time measuring unit, the substrate, to which the adhesive tape of a measuring target is attached, is forcibly transferred to the downstream side, and the component is compressed to the substrate in the component compression unit.

A component crimping apparatus control method which enables a measuring tool to directly measure a temperature of a part pressed by a pressing head. The component crimping apparatus control method is applied to a component crimping apparatus which crimps a component onto a plate-shaped workpiece, and causes a measuring tool shaped identically as the workpiece to measure a temperature or a pressure of a pressed part in a pressing process of pressing a component onto the workpiece using a heated pressing head. The method includes acquiring information indicating whether or not the measuring tool is held in the component crimping apparatus, and, in the case where the information indicating that the measuring tool is held is acquired, positioning the measuring tool identically as the workpiece, and executing the pressing process on the component to be attached to the measuring tool after the positioning.

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Yamanashi, Japan

Chihiro Igarashi