Kabushiki Kaisha Moric

Yamaha Motor Electronics Co., Ltd.

Chihiro Araki

Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.

Wire bonding method and apparatus therefor

A semiconductor chip mounted on a substrate having a soldering land pattern for containing a molten solder interposed between said conductive surface and a facing surface of the semiconductor chip. The soldering land pattern comprises corners spaced respectively from the four corners of the semiconductor chip bottom surface and escapes formed between the corners sufficiently outside of the respective sides of the semiconductor chip bottom surface to accept liquid solder displaced from the area between the conductive surface and the facing surface of the semiconductor chip upon placing the semiconductor chip within the soldering land pattern to improve conductivity and simplify the construction. The device is also shown in a motor control.

Semiconductor chip soldering land pattern

A method and apparatus employing image processing of photographic data by a thermographic camera to determine the heat development of individual semiconductor devices. Therefore, defects of individual devices such as disconnection due to breaks and abnormal heat development due to electrostatic breakdowns can be determined reliably.

Inspection method and inspection apparatus for semiconductor circuit

A rotating electrical machine control embodying a circuit including semiconductor devices mounted on a conductive pattern formed on a metal substrate without using heat sinks. Performance is improved as is durability by matching the linear expansion coefficient of the resin used to seal the semiconductor chips with that of the conductive pattern formed on the metal substrate.

Growing community of inventors

Shuuchi-gun, Japan

Chihiro Araki