Intel Corporation

Samtec Incorporated

Chihhao Chen

Craig Schulz

David Hui

Yan Yang Zhao

Edwin Loy

A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.

Wirebondable interposer for flip chip packaged integrated circuit die

An optical communications circuit has a communications light signal source and a heat pump coupled to cool the signal source. A controller monitors a current and a temperature of the signal source, and regulates the temperature. The controller updates a heat pump control limit parameter for the heat pump, based on the monitored current. Other embodiments are also described and claimed.

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Fremont, CA, United States of America

Chihhao Chen