Shenzhen China Star Optoelectronics Technology Co., Ltd.

Chihche Liu

Yawei Liu

Weijing Zeng

Jiajia Qian

Taipi Wu

A packaging structure includes a substrate; a displaying component positioned on the substrate; a packaging cover plate arranged opposite to and spaced from the substrate; a loop of first enclosing resin arranged between the substrate and the packaging cover plate to enclose the displaying component and bond the substrate and the packaging cover plate together, where the first enclosing resin contains no spacer particle; and a loop of a second enclosing resin formed on an external circumferential area of the first enclosing resin and located between the substrate and the packaging cover plate, where the second enclosing resin is arranged to have a width smaller than a width of the first enclosing resin and contains therein spacer particles that are sized to define a predetermined spacing distance between the substrate and the packaging cover plate.

Packaging method and packaging structure of substrate

The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate () to be packaged, and a package cover plate (); forming an inorganic protective frame () in a round at the edges of the substrate (); manufacturing an OLED element () on the substrate () inside the inorganic protective frame (); pasting a solid glue film () on the package cover plate (); forming an adhesive () in a round on the package cover plate () corresponding to a location of the inorganic protective frame (); oppositely attaching the substrate () and the package cover plate (), and the substrate () and the package cover plate () are affixed together by the solid glue film () and the adhesive () to accomplish the package to the substrate () with the package cover plate ().

OLED package method and OLED package structure

The present invention provides a packaging method of a substrate and a packaging structure. The method includes: (1) providing a substrate and a packaging cover plate; (2) coating a loop of first enclosing resin on the packaging cover plate; (3) coating a loop of second enclosing resin on an external circumferential area of the first enclosing resin on the packaging cover plate; (4) laminating the packaging cover plate and the substrate together; (5) applying ultraviolet (UV) light to irradiate the first enclosing resin and the second enclosing resin for curing; and (6) carrying out cutting operations on the substrate and the packaging cover plate to remove portions of the substrate and the packaging cover plate that contact the second enclosing resin so as to achieve packaging of the substrate with the packaging cover plate.

The present invention provides a method for manufacturing an OLED panel. The method is simple and fixes a first substrate and a flexible material layer together by forming a support layer on the first substrate and forming, through etching, a groove in the support layer and coating UV resin in the groove so as to obtain a flexible material layer that is flat, operable, and not prone to deformation. After the formation of an OLED element, the portion outside an area delimited by the groove is trimmed off and the first substrate and the flexible material layer are separated to obtain a flexible OLED panel. This method allows for automation and does not cause damage to the components.

Growing community of inventors

Guangdong, China

Chihche Liu