Denki Kagaku Kogyo Kabushiki Kaisha

Chiharu Watanabe

Tatsuo Nakano

Kazuo Kato

Makoto Fukuda

Naomi Yonemura

An insulating material characterized by that said insulating material is made by curing a mixture composed of a bisphenol A type epoxy resin having purity which is equal to or more than 90% and an organic filler, the thermal conductivity thereof is in a range of 5.0.times.10.sup.-3 to 18.0.times.10.sup.-3 (cal/.degree.C..multidot.cm.multidot.sec) and the glass transition temperature thereof is in a range of 164.degree. to 240.degree. C.

Insulating material and a circuit substrate in use thereof

An insulating material characterized by that said insulating material is made by curing a mixture composed of a bisphenol A type epoxy resin having purity which is equal to or more than 90% and an organic filler, the thermal conductivity thereof is in a range of 5.0.times.10.sup.-3 to 18.0.times.10.sup.-3 (cal/.degree. C..multidot.cm.multidot.sec) and the glass transition temperature thereof is in a range of 164.degree. to 240.degree. C.

Insulating material

A circuit substrate for mounting a semiconductor element comprises an aluminum-copper clad foil laminated on a metallic base plate by interposing an insulating layer, wherein the roughness in average of the surface in contact with the insulating layer of the aluminum-copper clad foil is in a range of from 0.5 .mu.m to 50 .mu.m.

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Shibukawa, Japan

Chiharu Watanabe