Taiwan Semiconductor Manufacturing Comp. Ltd.

Chih-Yuan Chiu

Chi-chun Peng

Shih-Yen Chen

Hui-Ting Lin

Hong-kun Chen

Wei-Chih Chen

Cheng-Lung Wu

Ming-Tan Lee

Wen-Ming Chen

Yuh-Sen Chang

Yi-Ting Hu

Min-Yu Wu

Pei-Shan Wu

Yu-Lin Wang

Pin-Yi Shin

Yi-Kai Tu

A bonding tool and a bonding method are provided. The method includes attaching a semiconductor die to a bonding tool having a first surface, wherein the bonding tool comprises a bending member movably arranged in a trench of the bonding tool, and the bending member protrudes from the first surface and bends the semiconductor die; moving the semiconductor die toward a semiconductor wafer to cause a retraction of the bending member and a partial bonding at a portion of the semiconductor die and the semiconductor wafer; and causing a full bonding between the semiconductor die and the semiconductor wafer subsequent to the partial bonding.

Bonding tool and bonding method thereof

A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.

Semiconductor die dipping structure

A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.

Bonding apparatus and method

Growing community of inventors

Hsinchu County, Taiwan

Chih-Yuan Chiu