Lite-on Technology Corporation

Lite-on Opto Technology (changzhou) Co., Ltd.

Hanwit Precision Industries Ltd.

Nan Ya Technology Corporation

Chih-Yuan Chen

Ming-De Wu

Tien-Yu Lee

Chen-Hsiu Lin

Yu-Yu Chang

Chia-Hung Su

Yung-Chang Jen

Yu-Chou Lin

Chien-Tung Huang

Jiun-Bo Wang

Ming-Fa Tsai

Chih-Wang Hsu

Wei-Lun Tsai

Wei-Hsun Hsu

Yuan-Chi Hsieh

Wei-Chien Hung

Chen-hsiu Lin

Floating fastener includes base including main body provided with through hole, resisting ring protruded inside through hole, seat body extended around main body and docking portion protruded from seat body, positioning member having shank inserted into through hole, head located at one end of shank outside main body, joint portion located at an opposite end of shank to move in and out of docking portion and stopper provided between joint portion and shank to abut against resisting ring, elastic member set on shank and stopped between head and resisting ring, and pad provided with inner hole which is inserted outside docking portion of base, so that pad abuts against seat body near the docking portion. The pad is made of soft material, which can achieve the purpose of absorbing the shaking and vibration of the floating fastener under the influence of external force.

Floating fastener

A light emitting package is provided, the light emitting package includes a carrier having a main part that has multiple chip bonding regions, and each the chip bonding regions has two neighboring conductive parts. An insulating part is disposed on the main part and portion of the two neighboring conductive parts, and multiple hollow-out structures are formed by the insulating part and corresponded in position to the chip bonding regions. Each of the hollow-out structures has a side wall that surrounds the chip bonding regions, and the portion of the tops of the two neighboring conductive parts are exposed from a bottom portion of the hollow-out structure, and multiple light emitting chips are disposed onto the chip bonding surfaces.

Chip bonding region of a carrier of light emitting package and manufacturing method thereof

A light emitting unit includes a reflective structure, a light transmitting body and a light emitting chip. The reflective structure has a recess formed by inner side surfaces thereof, and the reflective structure includes a side opening and a bottom opening corresponding to the recess. The side opening and the bottom opening are adjacent to each other, and the inner side surfaces are defined as a top surface and a surrounding side surface. The light transmitting body is disposed within the recess and doped with fluorescent powder. The light transmitting body includes a light emitting surface and an electrode exposing surface. The light emitting surface is corresponding to the side opening; and the electrode exposing surface is corresponding to the bottom opening. The light emitting chip is partially disposed within the light transmitting body and has a bottom, a top light emitting and side light emitting surfaces.

Light emitting unit

A polishing delivery apparatus, configured to provide slurry and rinse agent to a polishing pad, includes a delivery arm, at least one first nozzle, and at least one second nozzle. The delivery arm is rotatably connected to the polishing pad and has an arc-shaped top surface facing away from the polishing pad, a bottom surface facing away from the arc-shaped top surface, and a recess indenting from the bottom surface. The first nozzle is mounted on the bottom surface of the delivery arm and has a first nozzle head facing toward the polishing pad. The second nozzle is mounted in the recess of the delivery arm and has three second nozzle heads, in which one of the three second nozzle heads faces toward the polishing pad, and the other two of the three second nozzle heads face toward sidewalls of the recess.

Polishing delivery apparatus

A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.

Chip-scale LED package structure

A floating fastener includes a socket fastened to a first board member, a locking device axially slidably mounted in the socket and adapted for locking the socket and the first board member to a second board member, and an insulative barrel including a flexible barrel body attached onto the socket, a cap for capping on the barrel body to shield the locking device in the socket and to protect the socket and the locking device against corrosion and a flexible connecting strip connected between the barrel body and the cap.

The present disclosure illustrates a fixing device comprising a sleeve which has a through hole inside and has grooves recessed on an outer surface thereof, and is placed inside receiving space of an outer casting tube, and the receiving space being formed with longitudinal protrusion rib disposed on an inside wall thereof and slidable in the grooves, and a head part is disposed inside the receiving space and has a mounting; a resilient component is abutted between the head part and the sleeve; a fastener fixed on the head part and having a riveting part mounted in the mounting hole, and a rod extended from a bottom thereof and inserted through the through hole, and having longitudinal sections and arc surfaces and the rod having a stop part outwardly protruded on a bottom side thereof, and having a guiding incline formed at top thereof.

Fixing device

Detachable mounting device includes mounting member defining therein accommodation open chamber, mounting through hole, annular inside flange between accommodation open chamber and mounting through hole and annular positioning groove between annular inside flange and mounting through hole, and fastening member having head positioned in the annular positioning groove and fastening shank suspending in the mounting through hole and adapted for fastening to mating connection member of predetermined panel member to secure the mounting member to the predetermined panel member. The outer diameter of the fastening member is larger than the inner diameter of the annular inside flange and the inner diameter of the mounting through hole, so that the fastening member is prohibited from falling out of the annular positioning groove. The wide top and narrow bottom design of the mounting member facilitates user holding the base portion with the hand to lift and delivery the predetermined panel member conveniently.

Detachable mounting device

A hinge of low profile design includes a bearing seat member made of a non-deformable metal and providing an axle hole and a mating connection part that is fastened to a first panel member, a pivot shaft including a disc-shaped head pivotally coupled to the axle hole, a stem extended from the disc-shaped head and suspending outside the axle hole and conical riveting portion located at the distal end of the stem and riveted to a through hole of a second panel member, and a washer mounted around the step and stopped between the bearing seat member and the second panel member for allowing relative rotation between the first panel member and the second panel member smoothly and stably.

Hinge

An LED package structure includes a substrate, a circuit layer and an insulating layer both disposed on the substrate, a light-emitting unit, and a reflective housing integrally formed with the insulating layer. The light-emitting unit includes an LED chip and a fluorescent body encapsulating the LED chip. The light-emitting unit is mounted on the insulating layer and the circuit layer. The fluorescent body of the light emitting unit is spaced apart from the circuit layer with a gap in a range of 3&#x2dc;10 &#x3bc;m. The reflective housing is formed on the insulating layer and the circuit layer and is further filled within the gap. A top plane of the reflective housing arranged away from the substrate is lower than or equal to that of the light-emitting unit, and a distance between the two top planes is in a range of 0&#x2dc;30 &#x3bc;m.

LED package structure

An LED package structure includes a base, an LED chip disposed on the base, at least one metal wire, a phosphor sheet, and an encapsulation resin disposed in the base and encapsulating the LED chip, the metal wire, and the phosphor sheet. The LED chip has at least one electrode thereon. The metal wire has an apex and a loop height being defined by the apex. The metal wire is electrically connected to the electrode and the base. The phosphor sheet includes a B-stage resin and a plurality of phosphor powders mixed therewith. The phosphor sheet is adhered to the LED chip by the B-stage resin capable of viscosity and covers the top surface, the side surface, and the electrode of the LED chip. A thickness of the phosphor sheet is smaller than the loop height, and the apex of the metal wire is exposed from the phosphor sheet.

A manufacturing method of an LED package structure includes the steps of providing a base; disposing an LED chip on the base; electrically connecting the base and the LED chip by at least one metal wire, wherein the metal wire has an apex, and a height between the apex and a top surface of the LED chip is defined as a loop height; adhering a first phosphor sheet to the LED chip by a B-stage resin of the first phosphor sheet, wherein the first phosphor sheet covers the top surface, the side surface, and the electrode of the LED chip, the thickness of the first phosphor sheet is smaller than the loop height, and the apex of the metal wire is exposed from the first phosphor sheet; and disposing an encapsulation resin in the base to encapsulate the LED chip, the metal wire, and the first phosphor sheet.

Growing community of inventors

Taipei, Taiwan

Chih-Yuan Chen