Advanced Semiconductor Engineering, Inc.

Chih Yi Huang

Chih-Wei Wu

A semiconductor structure comprising a first signal layer, a second signal layer, a wiring layer and at least one via is provided. The wiring layer is formed between the first signal layer and the second signal layer. A conducting wire is disposed between a first terminal and a second terminal on the wiring layer. At least one via is used to conduct the first signal layer and the second signal layer. The at least one via is disposed adjacent to the first terminal and the second terminal.

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Kaohsiung, Taiwan

Chih Yi Huang