Htc Corporation

Chih-Yao Kuo

Chin-Kai Sun

Chung-Chiao Tan

Wei-Cheng Liu

Chun-Lung Chu

Chun-Hao Lin

Szu-Han Wu

Tzu-Chia Tan

Tung-Hsin Yeh

Jen-Cheng Lai

Jia-Yuan Hsu

A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 &#x3bc;m to 130 &#x3bc;m.

Fan blade and fabricating method thereof

An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.

Electronic device

An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.

A head-mounted display device includes a casing, a control circuit board and a fan. The casing has a heat dissipation hole, and a face side and an external side opposite each other. The control circuit board is disposed in the casing. The fan is disposed in the casing and located between the control circuit board and the face side of the casing, and is configured to generate an air flow flowing from the face side toward the heat dissipation hole.

Head-mounted display device

A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.

Heat dissipation module and electronic device

A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

Heat dissipation module manufacturing method, heat dissipation module and electronic device

A recording device includes a camera component, a temperature sensor, and a processing component. The camera component is configured to capture a video to generate video data. The temperature sensor is configured to detect an operating temperature of the recording device. The processing component is configured to process the video data, and to enable the camera component to dynamically adjust at least one of a data rate of the video data and a frame rate of the video data according to the operating temperature during the camera component captures the video.

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Taoyuan, Taiwan

Chih-Yao Kuo