Macronix International Co., Ltd.

Faraday Technology Corporation

Chih-Wen Lin

Chen Jung Tsai

Chen-Jung Tsai

Jui-Chung Lee

An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

Ultra thin image sensor package structure and method for fabrication

A dual chips stacked packaging structure. A first chip comprises an active surface and an opposing non-active surface, the active surface consisting of a central area and a peripheral area having a plurality of first bonding pads. A lead frame comprises a plurality of leads and a chip paddle having a first adhering surface and a second adhering surface, with the first adhering surface adhering to the active surface of the first chip in such a way as to avoid contact with the first bonding pads. A second chip comprises an active surface and an opposing non-active surface connecting with the second adhering surface of the chip paddle, and the active surface consisting of a central area and a peripheral area having a plurality of second bonding pads. Parts of the wires electrically connect with the first bonding pad and the leads, and parts of the wires electrically connect with the second bonding pad and the leads.

Dual chips stacked packaging structure

A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Ultra thin dual chip image sensor package structure and method for fabrication

A method for performing a built-in and at-speed test in a system-on-chip includes receiving a statistic timing analysis report of the system-on-chip, determining a plurality of critical paths for an at-speed test in the system-on-chip according to the statistic timing analysis report, analyzing signals at observe control points and capture control points of each of the critical paths for generating a plurality of test states, and transmitting the test states to a virtual instrumentation software architecture wrapper.

Method for performing built-in and at-speed test in system-on-chip

A digital logic test method for systematically testing a pipeline-structured integrated circuit chip is disclosed. The method includes the steps of: providing an integrated circuit chip capable of executing a plurality of instructions during a period of time, each of the instructions being executed according to a plurality of sequentially ordered operation segments, sorting the instructions, and designing a plurality of test patterns to test the integrated circuit according to the sorting result and STAGE test segments corresponding to the STAGE operation segments.

Digital logic test method to systematically approach functional coverage completely and related apparatus and system

A semiconductor packaging device comprises a carrier having at least a cavity or a slot thereon. At least a chip has a back surface and an active surface with a plurality of first bonding pads. The chip is affixed to the cavity to expose the active surface. A first insulating layer is on the active surface and the carrier, which comprises first via-conductor connected to first bonding pads and via the first insulating layer. A multi-layer structure on the first insulating layer comprises a plurality of conductive layout lines, second via-conductor therein, and a second insulating layer, exposed ball pads, and flip-chip pads thereon. The first via-conductor are electrically connected with the conductive layout lines, the second via-conductor, the exposed ball pads, and the flip-chip pads. The first solder balls are affixed to the ball pads, and at least a second chip is affixed to the flip-chip pads through a plurality of second solder balls.

Semiconductor packaging device and manufacture thereof

A method for functional verification of hardware design. First, a first memory region storing a test pattern and a second memory region storing interrupt instructions are provided. Then, the test pattern stored in the first memory is hardware-simulated. If an external interrupt is received during the simulation of the test pattern, the second memory region is accessed and the interrupt instructions are hardware-simulated. Thereafter, the simulated result of the interrupt instructions is self-tested to obtain a first verification result, and the hardware design is verified according to the first verification result.

Method for functional verification of hardware design

A thin stacked image sensor package containing an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

A semiconductor packaging device has a carrier having at least a portion configured for containing a chip. The chip, affixing to the portion with sidewall, has a back surface an active surface, which multitudes of bonding pads are on the active surface. One insulating layer on the active surface and carrier has multitudes of conductive holes corresponding to the first bonding pads. A multi-layer structure on the insulating layer is configured for providing electrical connection to the conductive holes. Another insulating layer, affixed on one of the carrier and the multi-layer structure, has another conductive holes electrically connected to the conductive holes. Multitudes of solder balls, on at least one of the carrier and latter insulating layer, electrically connect the latter conductive holes.

Semiconductor packaging device

A stacking structure is described that permits stacking of electrical components with no requirement for an ancillary stacking framework. Electrical components are fabricated with inner and outer lead portions that provide connection to a substrate and to other electrical components in a stack.

Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection

A stacked semiconductor packaging device consists of at least a stacked multi-chip device comprising a substrate. A first chip has a back surface faced towards the substrate and an active surface comprising a plurality of bonding pads which have a first set of elongate conductors connected to the substrate. A second chip has another back surface and another active surface comprising a plurality of bonding pads which have a second set of elongate conductors connected to the substrate. The active surface of the second chip is faced towards the active surface of said first chip and is stacked atop the first chip so as to expose all of the bonding pads. The face-to-face arrangement of the first chip and the second chip can reduce the whole packing height.

Stacked semiconductor packaging device

A structure of a stacked-type multi-chip stack package of the leadframe, the shape of the stair-like inner leads can be regulated for the high and the amount of stacked chips and to match different bonding technology. The process for forming the present structure can be easily performed by visible equipment and materials, and the present structure can raise the reliability of bonding process. The present invention can stack multi-chip (more than two).

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Hsinchu, Taiwan

Chih-Wen Lin