Everdisplay Optronics (shanghai) Limited

Chih-wei Wen

Kunliang Ma

Yanhu Li

Denghui Liu

A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.

Method for cutting display panel

A sintering method includes defining a closed pattern having at least one arcuate section. A substance is applied on a substrate along the closed pattern and is sintered along the closed pattern in a first rectilinear direction. The sintering is finished in a second rectilinear direction along the closed pattern. A display device packaging method includes defining a closed pattern having at least one arcuate section. Frit is applied on a substrate of a display device along the closed pattern. A cover plate is provided on the substrate. The frit is sintered along the closed pattern. The sintering is finished in a second rectilinear direction. Then, the cover plate and the substrate of the display device are packaged.

Sintering method and display device packaging method using the same

A display device includes a display module, a cover, and a bonding layer between the display module and the cover. A first ink layer is disposed in at least a portion between the cover and the bonding layer. A second ink layer is disposed in at least a portion between the display module and the bonding layer. A method for producing a display device includes applying an ink on an end of a cover to form a first ink layer. A bonding layer is formed on the first ink layer and the cover. A display module is provided and coupled to the cover via the bonding layer.

Display device and method for producing the same

A display device includes a bonding layer between a display module and a cover. An ink layer and a fluorescent layer are disposed between the cover and the bonding layer. A method for producing a display device includes applying a fluorescent layer on at least one end of a cover; applying an ink layer on the fluorescent layer, with the ink layer not contacting the cover; forming a bonding layer on the ink layer and the cover; and coupling a display module to the cover via the bonding layer. In another approach, a method includes applying an ink layer on at least one end of a cover; applying a fluorescent layer on the cover at a location other than the ink layer; forming a bonding layer on the ink layer, the fluorescent layer, and the cover; and coupling a display module to the cover via the bonding layer.

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Shanghai, China

Chih-wei Wen