Advanced Semiconductor Engineering, Inc.

National Sun Yat-sen University of Kaohsiung

Chih-Wei Huang

Min Lung Huang

Der-Min Tsay

Hsin-Pao Chen

Hung-Jung Tu

Hsin Hsiang Wang

Shiuan-Yu Lin

Hsien-Wen Hsu

The present disclosure provides a semiconductor device package. The semiconductor device package includes a first semiconductor device, a first conductive layer and a second conductive layer. The first semiconductor device has a first conductive pad. The first conductive layer is disposed in direct contact with the first conductive pad. The first conductive layer extends along a direction substantially parallel to a surface of the first conductive pad. The second conductive layer is disposed in direct contact with the first conductive pad and spaced apart from the first conductive layer.

Semiconductor device package and method of manufacturing the same

A transmission mechanism with intermittent output movement includes an output shaft rotatably mounted to first and second cams and a sun gear mounted to the output shaft. A first rocker includes a first planet gear meshed with the sun gear and first and second rollers rotatably mounted on opposite sides of the first planet gear and respectively in contact with the first and second cams. A second rocker includes a second planet gear meshed with the sun gear. An end of a first connecting rod is mounted to the first rocker. An end of a second connecting rod is mounted to the second rocker. Two ends of a link are rotatably mounted to the other ends of the first and second connecting rods. A planet gear carrier is mounted to an input shaft coaxial to the input shaft and includes an end rotatably mounted to the first rocker.

Transmission mechanism with intermittent output movement

Growing community of inventors

Kaohsiung, Taiwan

Chih-Wei Huang