Inventec Corp.

United Microelectronics Corp.

Richwave Technology Corp.

Other

Dell Products Inc.

Institute for Information Industry

Bridging Partners Corporation

Lite-on Technology Corporation

Inventec (pudong) Technology Corporation

Chaun-choung Technology Corp.

Chih-Wei Chen

Chien-Ting Lin

Ssu-I Fu

Shih-Hung Tsai

Ying-Tsung Chen

Wen-Tai Chiang

Shyh-Chyi Wong

Tung Yu Chien

Kuang-Ming Kuo

Hsiao-Fen Lu

Yu-Cheng Tung

Chun-Hsien Lin

Che-Wei Chang

An-Chi Liu

Hsuan-Hsu Chen

Ying-Chih Lin

Chuan-Jane Chao

Chun-Hsiung Wang

Ju-Hao Lee

Yun-Shan Chang

Chiu-Hsien Yeh

Shao-Wei Wang

Yi-Chun Lin

Chin-Wei Tien

Chiou-Shann Fuh

Tsyr-Shyang Liou

Chi-Hung Kao

Chia-Wei Tien

Sheng-Hung Wang

Cheng-Deng Kuo

Ming-Huang Shih

Jiong-Guang Su

Chia-Min Lai

Hui-Hua Chiang

Jui-Yu Chang

Ja-Hao Chen

Pei-Yi Lin

Cheng-Min Lin

Kai-Ping Wang

Jin-Lien Lin

Zu-Chao Hsu

Han-Hau Wu

Shao-Hua Chen

Min-Chuan Wan

Wei-Chen Tou

Jui-Chieh Chiu

Ching-Kuo Wu

I-Shan Chen

A fuzz testing apparatus transmits a plurality of packets to the device under test (DUT), and calculates a probability of abnormal state, a normal response time and an abnormal-state-processing time of the DUT for the packets. Then, the fuzz testing apparatus estimates a maximum quantity of packets that can be sent to the DUT according to the probability of abnormal state the normal response time and the abnormal-state-processing time corresponding to the standby time of the DUT. Finally, the fuzz testing apparatus determines a plurality of test packets from a plurality of candidate test packets according to the maximum quantity of packets.

Fuzz testing apparatus and fuzz testing method

An adaptor for connecting a cover to an overflow pipe includes an H-shaped body which is installed in an end portion of the overflow pipe. The lengthwise length of the adaptor is not longer than the outer diameter of the end portion of the overflow pipe. The adaptor includes a first connection portion formed to the center of the adaptor, and two second connection portions respectively formed to two ends of the adaptor. Two lateral sides are formed to two sides of the adaptor. The cover includes a notch communicating with the end portion of the overflow pipe. Multiple protrusions extend from the inner bottom of the cover. The protrusions are engaged with the two lateral sides of the adaptor to connect the cover to the adaptor. Bolt(s) extend through first or second connection portions of the adaptor and are connected to the end section of the overflow pipe.

Adaptor for connecting cover to overflow pipe

A networking behavior detector and a networking behavior detection method thereof for an indoor space are provided. The networking behavior detector receives a plurality of radio frequency (RF) signals in the indoor space and converts the RF signals to a plurality of digital signals. Next, the networking behavior detector calculates an energy value of each digital signal and filters out the digital signal, the energy value of which is smaller than a threshold, of the digital signals to generate an analysis signal. Finally, the networking behavior detector retrieves a plurality of energy feature values of each analysis signal to generate a feature datum, and analyzes the feature data through an identification model to generate an identification result. The identification result corresponds to one of a plurality of networking behaviors.

Networking behavior detector and networking behavior detection method thereof for indoor space

A stopper of a bathroom sink or tub includes a shank removably connected to a base part which is connected to the sink or tub and has a drain hole. A cap is connected to the shank and has a flange that extends radially from the cap. A connection portion is formed on the underside of the flange. A seal part is connected to the connection portion and includes a support ring and a collar. The support ring has at least one hook member formed in the inner periphery thereof so as to be connected to the connection portion of the cap. A positioning portion extends from radially from the support ring. The collar is a rubber collar and has a groove in the inner periphery thereof. The positioning portion of the support ring is engaged with the groove to prevent the collar from deformation and generating noise.

Support device for stopper of bathroom sink or tub

A semiconductor device includes: a gate structure extending along a first direction on a substrate, in which the gate structure includes a first edge and a second edge extending along the first direction; a first doped region adjacent to one side of the gate structure, in which the first doped region includes a third edge and a fourth edge extending along the first direction; a second doped region adjacent to another side of the gate structure, in which the second doped region comprises a fifth edge and a sixth edge extending along the first direction; a first fin-shaped structure extending from the second edge of the gate structure toward the third edge of the first doped region; and a second fin-shaped structure extending from the first edge of the gate structure toward the sixth edge of the second doped region.

Semiconductor device and method for fabricating the same

A method for classifying and searching data includes marking classifications on a plurality of records according to data comprised by root cause fields or comment fields of the records; generating an index according to data comprised by synopsis fields of the records; marking weights on the records according to categories of data comprised by the synopsis fields of the records; utilizing the index for searching a plurality of corresponding records from the records according to a keyword; and selecting a plurality of related records from the corresponding records according to the weights of the corresponding records, and listing the classifications of the related records.

Device and method for classifying and searching data

A multiple connector assembly includes a connector housing. A first connector and a second connector, adjacent the first connector, extend from a first surface of the connector housing. A securing member is coupled to the connector housing and is configured to engage a connector coupling member to secure the first connector in a first connector receptacle and the second connector in a second connector receptacle. A connector release actuator that is located on a second surface of the connector housing that is opposite the first surface of the connector housing. The connector release actuator is configured to actuate the securing member to cause the securing member to disengage with the connector coupling member such that the first connector is no longer secured in the first connector receptacle and the second connector is no longer secured in the second connector receptacle.

Multiple connector system

An overflow assembly includes an overflow pipe having a mounting end. Multiple engaging portions are defined in the outer periphery of the mounting end. Each engaging portion has an opening and a toothed section. The opening opens to the distal end of the mounting end and communicates with an L-shaped path. The toothed section is defined in one of insides of the path. A collar is rotatably mounted to the mounting end and a protrusion extends radially and inward from the inner periphery of the collar so as to be engaged with the toothed section. The collar is rotated by engaging the protrusion with the toothed section and contacts against the bathtub's wall. An O-ring is axially mounted to the collar. A cap having an overflow aperture is mounted to the collar. The collar is cooperated with the toothed section and no threads are needed.

Engaging device for overflow assembly

An information handling system (IHS) includes a reinforced edge card connector having a terminal block having a mounting surface attached to a surface of a first Printed Circuit Board (PCB). A connector housing has a connector opening aligned to the surface of the PCB to receive an edge of a second PCB. An upper row of upper conductors and a lower row of lower conductors are positioned in respective opposition to frictionally engage opposite sides of the edge of the second PCB, wherein the upper conductors are cantilevered pins. The connector housing exposes a bent portion of the cantilevered pins of the upper row of upper conductors. A flexible sheet is attached to an outward surface of the connector housing and to exposed surfaces of the upper row of upper conductors to create a binding force to multiple cantilevered pins to resist deformation.

Reinforced right-angle type board edge connector

A semiconductor device includes: a gate structure on a substrate; a first doped region adjacent to one side of the gate structure; a second doped region adjacent to another side of the gate structure; and fin-shaped structures on the substrate. Preferably, a number of the fin-shaped structures covered by the gate structure is different from a number of the fin-shaped structures overlapping the first doped region or the second doped region.

A remote control system and method for lighting apparatus may include at least a remote-controlled lighting apparatus and an intelligent communication device. The lighting apparatus comprises a lighting unit, a first central processing unit (CPU) and a first communication unit, and the intelligent communication device comprises a second CPU, a second communication unit and at least a button and a storage unit. The storage unit is configured to store a control program, the Universally Unique Identifier of the lighting apparatus and at least an operating command of the lighting apparatus corresponding to the sequential key-in signal. When activated, the control program can execute the operating command stored in the storage unit corresponding to the sequential key-in signal input by a user, and send the operating signal to the lighting apparatus through the second communication unit to remotely control at least a lighting unit of the lighting apparatus.

Remote control method and system for lighting apparatus

An information handling system (IHS) includes a reinforced edge card connector having a terminal block having a mounting surface attached to a surface of a first Printed Circuit Board (PCB). A connector housing has a connector opening aligned in parallel to the surface of the PCB to receive an edge of a second PCB. An upper row of upper conductors and a lower row of lower conductors are positioned in respective opposition to frictionally engage opposite sides of the edge of the second PCB, wherein the upper conductors are cantilevered pins. The connector housing exposes a bent portion of the cantilevered pins of the upper row of upper conductors. A flexible sheet is attached to an outward surface of the connector housing and to exposed surfaces of the upper row of upper conductors to create a binding force to multiple cantilevered pins to resist deformation.

The present invention provides a non-planar FET which includes a substrate, a fin structure, a sub spacer, a gate, a dielectric layer and a source/drain region. The fin structure is disposed on the substrate. The sub spacer is disposed only on a middle sidewall of the fin structure. The gate is disposed on the fin structure. The dielectric layer is disposed between the fin structure and the gate. The source/drain region is disposed in the fin structure. The present invention further provides a method of forming the same.

Manufacturing method of non-planar FET

A non-planar semiconductor structure comprises a substrate, at least one fin structure on the substrate, a gate covering parts of the fin structures and part of the substrate such that the fin structure is divided into a channel region stacking with the gate and source/drain region at both sides of the gate, a plurality of epitaxial structures covering on the source/drain region of the fin structures, a recess is provided between the channel region of the fin structure and the epitaxial structure, and a spacer formed on the sidewalls of the gate and the epitaxial structures, wherein the portion of the spacer filling in the recesses is flush with the top surface of the epitaxial structures.

Semiconductor structure

A method of forming a semiconductor device is provided. A first interfacial material layer is formed by a deposition process on a substrate. A dummy gate material layer is formed on the first interfacial material layer. The dummy gate material layer and the first interfacial material layer are patterned to form a stacked structure. An interlayer dielectric (ILD) layer is formed to cover the stacked structure. A portion of the ILD layer is removed to expose a top of the stacked structure. The stacked structure is removed to form a trench in the ILD layer. A second interfacial layer and a first high-k layer are conformally formed at least on a surface of the trench. A composite metal layer is formed to at least fill up the trench.

Method of forming semiconductor device having metal gate

Growing community of inventors

Taipei, Taiwan

Chih-Wei Chen