Siliconware Precision Industries Co., Ltd.

Chih-Sheng Hsu

Chieh-Lung Lai

Chang-Yueh Chan

An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the LED chips and the electrical contacts; and a phosphor covering the LED chips, the electrical contacts and the bonding wires. The LED chips are disposed at different heights so as to allow the portions of the phosphor on the LED chips to have different thicknesses and thus generate light with different color temperatures.

Growing community of inventors

Taichung, Taiwan

Chih-Sheng Hsu