Taiwan Semiconductor Manufacturing Comp. Ltd.

Chih Ping Liao

Szu-Ying Chen

Sen-Hong Syue

Cheng-Po Chau

Ya-Wen Chiu

Yi Che Chan

YungHao Wang

Yi Chen Ho

Ker-Hsun Liao

Chi-Hsun Lin

Wei-Ming Wang

Chien Lin

Jie-Ying Yang

Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.

Device and method for high pressure anneal

A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Systems and methods for reducing vibration of apparatuses

A method of cleaning includes placing a semiconductor device manufacturing tool component made of quartz on a support. A cleaning fluid inlet line is attached to a first open-ended tubular quartz projection extending from an outer main surface of the semiconductor device manufacturing tool component. A cleaning fluid is applied to the semiconductor device manufacturing tool component by introducing the cleaning fluid through the cleaning fluid inlet line and the tubular quartz projection.

Method of cleaning, support, and cleaning apparatus

Growing community of inventors

Hsinchu, Taiwan

Chih Ping Liao