Asia Vital Components Co., Ltd.

Wistron Corporation

Kinik Company

Chih-Peng Chen

Yu-Min Lin

Hsin-cheng Lin

Tien-Chung Tseng

Han-Min Liu

Chih-Sheng Chou

Yen-Chang Cheng

Huai-Gang Liu

Hsiao-Kuo Chang

Jen-Sheuan Huang

Huang-Pin Shen

Na-Ling Chen

Po-Lun Lin

Shih-Pang Wen

Chia-Jou Chen

Xing-Hui Li

A thermal module includes a copper base seat, at least one U-shaped aluminum heat pipe, an aluminum radiating fin assembly and a copper embedding layer. The copper base seat has a heat absorption side and a heat conduction side. The heat absorption side or the heat conduction side is recessed to form at least one first heat pipe receiving channel. The U-shaped aluminum heat pipe has a horizontal section as a heat absorption section and two vertical sections as condensation sections. The heat absorption section is positioned in the first heat pipe receiving channel. The aluminum radiating fin assembly has multiple radiating fins. The copper embedding layer is disposed on a surface of the heat absorption section of the U-shaped aluminum heat pipe. By means of the copper embedding layer, two different materials can be directly welded.

Thermal module

A vapor-phase/liquid-phase fluid heat exchange unit includes: a first cover body having a first and a second side, a vapor outlet and a liquid inlet, the vapor outlet and the liquid inlet being in communication with the first and second sides; and a second cover body having a third and a fourth side, the first and second cover bodies being correspondingly mated with each other to together define a heat exchange space. A working fluid and a fluid separation unit are disposed in the heat exchange space. The fluid separation unit partitions the heat exchange space into an evaporation section corresponding to the vapor outlet and a backflow section corresponding to the liquid inlet.

Vapor-phase/liquid-phase fluid heat exchange unit

A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.

Vapor/liquid condensation system

A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.

Heat dissipation device

A thermal module having an integral body including a base seat with a raised section and a heat dissipation unit with a recess such that the raised section of the base seat fits into the recess of the heat dissipation unit to connect the heat dissipation unit with the base seat. An inner end of the recess is formed with at least one lateral protrusion extended toward an opposite end of the recess and at least one end of the raised section is formed with a groove corresponding to the protrusion, the protrusion being inserted in and connected to the groove.

A connecter mechanism includes a casing, a half socket and a door. The casing includes a first actuating portion, an opening and a pivot hole. The half socket is disposed inside the casing. The door is movably disposed on the casing to cover the half socket. The door includes a body, at least one pivot shaft, a cover and a second actuating portion. The pivot shaft is disposed on a side of the body. The cover is connected to an edge of the body for covering the opening. The second actuating portion is connected to the other edge of the body opposite to the cover. Position of the cover relative to the opening is adjusted via the second actuating portion and the first actuating portion.

Connector mechanism and related electronic device

The present disclosure provides a jig for surface treatment, which is used for fixing a metal plate having a bearing for surface treatment. The jig for surface treatment according to the present disclosure passes a hanging rod through the metal plate. Thereby, the jig for surface treatment will not contact with a processed surface of the metal plate and hence making no apparent flaws on the processed surface and maintaining completeness processed surface. In addition, the jig for surface treatment can load a plurality of metal plates at a time, performing surface treatment on the plurality of metal plates simultaneously, and thus improving productivity and practicability.

Jig for surface treatment

A button mechanism includes a casing. A lock hole and an engaging portion are formed and disposed on a bottom of the casing, and a plurality of open slots is formed on a lateral wall of the casing. The button mechanism further includes a plurality of buttons respectively disposed on the corresponding open slots, a fixing component, and a supporting component. An end of the supporting component is engaged with the engaging portion. The supporting component includes a first part whereon a piercing hole is formed. The fixing component pierces through the piercing hole and the lock hole to fix the first part on the bottom of the casing. The supporting component further includes a second part connected to the first part and contacting against the plurality of first buttons for constraining movements of the plurality of buttons relative to the casing.

Button mechanism and electronic device thereof

A diamond substrate and a method for fabricating the same are provided wherein a SiC layer is formed on a lower surface of a diamond layer for preventing the diamond layer from being deformed after the process of forming the diamond substrate, and then a semiconductor layer is formed on the diamond layer or directly formed on the surface of the SiC layer. Thereby, the lattice mismatch between the diamond film layer and the semiconductor layer is mitigated by the SiC layer, and the crystalline quality of the semiconductor layer is improved, the fabricating process of the diamond substrate is simplified, and the performance and stability are enhanced.

Diamond substrate and method for fabricating the same

A double-winged radiator for central processing unit (CPU) includes a heat-transfer block mounted on a top of a CPU that produces a large amount of heat during an operation thereof, and two sets of first radiator fins fixed to two outer ends of at least one heat-transfer tube that is seated on a top of the heat-transfer block. The heat produced by the CPU and transferred to the heat-transfer block is further transferred via the heat-transfer tube to the two sets of first radiator fins that provide large radiating area and high radiating efficiency to allow quick dissipation of heat therefrom. A locating member may be mounted on and between the two sets of first radiator fins to protect the latter from deformation under pressure. One set of second radiator fins may be mounted between the two sets of first radiator fins to provide increased radiating area and efficiency.

Double-winged radiator for central processing unit

A CPU radiator holding mechanism. The mechanism includes a pressure-bearing unit, a pair of holding-down clamps, and a seat for holding a radiator to a main board above a CPU. The radiator is formed from radiating fins and is provided at a top thereof with a receiving recess for receiving the pressure-bearing unit therein. The holding-down clamps are provided with hooks for engaging with receiving holes provided on the seat. The radiator is connected to the seat by pressing the holding-down clamps against the pressure-bearing unit and engaging the hooks of the holding-down clamps with the receiving holes of the seat, such that any pressure applied by the holding-down clamps onto the pressure-bearing unit does not cause any deformation of the radiating fins of the radiator.

Growing community of inventors

Taipei, Taiwan

Chih-Peng Chen