Inpaq Technology Co., Ltd.

Industrial Technology Research Institute

National Sun Yat-sen University of Kaohsiung

Taiwan Inpaq Electronic Co., Ltd.

Chih-Ming Su

Ta-Fu Cheng

Po-Kai Hsu

Ci-Jie Huang

Kin-Lu Wong

Chih-Wei Chen

Chia-Lun Tang

Jui-Hung Chou

Chun-Chieh Wang

Cheng-Yi Wang

Chih-Hsin Chiu

Shou-Jen Li

Yan-Ming Hong

Ding-Bing Lin

Chung-Ta Yu

En-Tso Yu

En-Zo Yu

Chung-Che Yang

Min-Sen Guo

Sheng-Chi Chen

A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Dual-band antenna module

The present invention provides a portable electronic device and a stacked antenna module thereof. The stacked antenna module includes a first antenna structure and a second antenna structure stacked on the first antenna structure and insulated from the first antenna structure. The first antenna structure includes a first carrier substrate having at least one through hole, a surrounding insulation layer disposed inside the at least one through hole, and a first feeding pin passing through the first carrier substrate. The second antenna structure includes a second carrier substrate and a second feeding pin passing through the second carrier substrate, and the second feeding pin passes through the surrounding insulation layer without contacting the surrounding insulation layer.

Stacked antenna module

The present disclosure provides a back cover assembly of a portable electronic device. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

Back cover assembly

The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

Portable electronic device and back cover assembly thereof

An antenna structure includes a board unit and a coil unit. The board unit includes a metal board and an insulating board connected with or adjacent to the metal board, and the coil unit is disposed beside the same side of the metal board and the insulating board. In one embodiment, when one narrow side of the metal board and one narrow side of the insulating board connects with each other, the coil unit is disposed right under the commissure of the metal board and the insulating board. In addition, more than half or half of the area of the coil unit is covered by the insulating board, and less than half or half of the area of the coil unit is covered by the metal board. The current direction on the metal board and the current direction on the coil unit are the same as clockwise or counterclockwise.

Antenna structure

An antenna structure includes a radiation module and a metal board. The radiation module has a first coil unit and a second coil unit. The first coil unit is coupled to the second coil unit. The first coil unit and the second coil unit have opposite direction of current. The metal board is disposed at one side of the radiation module. The metal board has an enclosed slot which has a first slot portion and a second slot portion.

An all-metal casing structure includes a casing unit, a first substrate unit, a second substrate unit, an antenna unit and a conductive unit. The casing unit includes at least one metal casing having at least one through opening. The first substrate unit includes at least one first substrate body disposed in the metal casing and neighboring to the through opening. The second substrate unit includes at least one second substrate body disposed in the metal casing and neighboring to the first substrate body. The antenna unit includes at least one antenna module disposed on the first substrate body and corresponding to the through opening, and the antenna module is electrically connected to the second substrate body. The conductive unit includes at least two conductive elements separated from each other by a predetermined distance and electrically connected between the metal casing and the first substrate body.

All-metal casing structure and antenna structure

A broadband antenna includes a substrate, a ground plane, a radiating path, a shorting path, a first connection path, a second connection path and a coupling path. The ground plane has a shorting point, a first grounding point and a second grounding point. The radiating path has a feeding point and a first connecting point. Two ends of the shorting path are respectively electrically connected with the shorting point and the feeding point, and the shorting path has a second connecting point. Two ends of the first connection path are respectively connected with the first connecting point and the second connecting point. Two ends of the second connection path are respectively connected with the first grounding point and the feeding point. One end of the coupling path is connected to the second grounding point and another end of the coupling path is separated from the shorting path.

Broadband antenna applied to multiple frequency band

An EMC (electromagnetic compatible) antenna having a shielding metal wall to effectively reduce the possible coupling with nearby electronic elements is presented. The antenna includes: a ground plane, a bent ground plate, and a radiating plate. The bent ground plate is vertically connected to the ground plane and functions as an effective shielding metal wall to eliminate or greatly reduce the possible EM coupling between the antenna and nearby electronic elements. The radiating plate is used to generate the operating resonant mode of the antenna and is generally parallel to the ground plane. The radiating plate is also electrically connected to and encircled by the bent ground plane.

Growing community of inventors

Taipei, Taiwan

Chih-Ming Su