Texas Instruments Corporation

Mediatek Corporation

Mstar Semiconductor, Inc.

Chih-Ming Hung

Khurram Muhammad

Dirk Leipold

Yen-Ju Lu

Robert Bogdan Staszewski

Tzu-Chin Lin

Jui-Lin Hsu

Wei-Hsiu Hsu

Wen-Chou Wu

Charvaka Duvvury

Jing-Hong Conan Zhan

Nan-Cheng Chen

Nathen Barton

Wen-Sung Hsu

Tao Cheng

Che-Ya Chou

Chao-Ching Hung

Yen-Tso Chen

Meng-Chang Lee

Jen-Hao Cheng

Hsiang-Yun Chu

ChiaYu Lin

Marco Corsi

Shih-Chieh Yen

Yao-Chi Wang

Bao-Chi Peng

Ming-Yu Hsieh

Dennis Mahoney

Sheng-Che Tseng

Ying-Tsang Lu

Dirk Leipol

Chih-Wei Chang

Tzu-Hung Lin

Srinath Mathur Ramaswamy

Brian Paul Ginsburg

Hsiang-Hui Chang

Qiang Li

Oren E Eliezer

Yu-Li Hsueh

Srikanth Krishnan

Chi-Hsueh Wang

Vijay Kumar Reddy

Bernard Ginetti

David W Evans

Chung-Hung Tsai

Imtinan Elahi

Gennady Feygin

Wen-Chieh Wang

Sameh Sameer Rezeq

Django Trombley

Zhongxuan Zhang

Keng-Meng Chang

Ismail Hakki Oguzman

Chun-Nan Li

Ying-Chou Shih

Elida Isabel De Obaldia

Francis P Cruise

Yo-Chuol Ho

Jun-Xiong Deng

Shih-Jung Chuang

Cheng-Chieh Lin

Shao-Hsiang Chang

Si-Ning Zhou

I-Wen Liu

Yueh-Ting Lee

Chih-Yang Liu

Yu Chun Lu

Bo-Jiun Chen

Chia-Yu Lin

Li-Ming Wei

Nathan Barton

Zhong-Xuan Zhang

Hung-Ju Wei

Yu-Chun Lu

A semiconductor package includes a base film, a semiconductor die on the base film, metal studs on the semiconductor die, shielding pillars on the base film and around the semiconductor die, a first molding compound encapsulating the semiconductor die, the metal studs, and the shielding pillars, a first re-distribution structure on the first molding compound, a second molding compound on the first re-distribution structure, through-mold-vias in the second molding compound, and a second re-distribution structure on the second molding compound and electrically connected to the through-mold-vias. The second re-distribution structure comprises an antenna.

Semiconductor package with integrated antenna and shielding pillars

A method for motion prediction includes receiving spatial information output by a radio-wave sensor, wherein the spatial information includes position and velocity of at least one point; receiving an image captured by a camera; tracking at least one object based on the spatial information and the image to obtain a consolidated tracking result; predicting a motion trajectory of the at least one object based on the consolidated tracking result to obtain a prediction result; and controlling the camera according to the prediction result.

Method and electronic device for motion prediction

A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method

Concepts and examples pertaining to reconfigurable radio frequency (RF) front end and antenna arrays for radar mode switching are described. A processor associated with a radar system selects a mode of a plurality of modes in which to operate the radar system. The processor then controls the radar system to operate in the selected mode by utilizing a plurality of antennas in a respective configuration of a plurality of configurations of the antennas which corresponds to the selected mode. Each configuration of the plurality of configurations of the antennas results in respective antenna characteristics. Each configuration of the plurality of configurations of the antennas utilizes a respective number of antennas of the plurality of antennas.

Reconfigurable RF front end and antenna arrays for radar mode switching

A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

Semiconductor package with layer structures, antenna layer and electronic component

A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Radar module incorporated with a pattern-shaping device

A system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock, and includes an active oscillator that generates the reference clock. The active oscillator includes at least one active component. The RX circuit generates a processed RX signal by processing an RX input signal according to the LO signal. The calibration circuit checks a signal characteristic of the processed RX signal by detecting if a calibration tone exists within a receiver bandwidth, set a frequency calibration control output in response to the calibration tone being not found in the receiver bandwidth, and output the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Apparatus and method for applying frequency calibration to local oscillator signal derived from reference clock output of active oscillator

A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.

Semiconductor chip with local oscillator buffer reused for signal transmission and associated transmission method

A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock.

Wireless system having local oscillator signal derived from reference clock output of active oscillator that has no electromechanical resonator

A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.

An object detection method includes: obtaining a first offset value and a second offset value, setting a first detection threshold value by adding the first offset value to a first reference threshold value, setting a second detection threshold value by adding the second offset value to a second reference threshold value, obtaining a detection input, and performing target detection upon the detection input according to at least the first detection threshold value and the second detection threshold value. The first offset value is different from the second offset value. The first reference threshold value is determined for detecting if at least one object with a first value of an object characteristic exists. The second reference threshold value is determined for detecting if at least one object with a second value of the object characteristic exists. The second value is different from the first value.

Method and apparatus for performing object detection by using detection threshold values derived from adding different offset values to reference threshold values

Various examples pertaining to a sensor system interconnect for automatic configuration of sensors of the sensor system are described. A sensor senses at least one parameter. The sensor also determines its respective position among a series of sensors. Based on a result of the determining, the sensor performing either a first procedure, responsive to the sensor being a first sensor in the series of sensors, or a second procedure, responsive to the sensor not being the first sensor in the series of sensors. The first procedure involves the sensor transmitting first data of the sensed at least one parameter via a second input/output (I/O) pin of the sensor. The second procedure involves the sensor receiving second data from a preceding sensor in the series of sensors via a first I/O pin of the sensor and transmitting the first data and the second data via the second I/O pin.

Sensor system interconnect for automatic configuration

A wireless system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock. The LO signal generation circuit includes an active oscillator. The active oscillator generates the reference clock, wherein the active oscillator includes at least one active component, and does not include an electromechanical resonator. The RX circuit generates a down-converted RX signal by performing down-conversion upon an RX input signal according to the LO signal. The calibration circuit generates a frequency calibration control output according to a signal characteristic of the down-converted RX signal, and outputs the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Apparatus and method for applying frequency calibration to local oscillator signal derived from reference clock output of active oscillator that has no electromechanical resonator

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McKinney, TX, United States of America

Chih-Ming Hung