Industrial Technology Research Institute

Young Lighting Technology Corporation

Hermes-epitek Corporation

Chih-Ming Hu

Yung-Hsing Huang

Che I Kao

Jung-Min Hwang

Chia-Hao Chang

Sung-Jeng Jong

Jeng-Yu Tsai

Jer-Young Chen

Shih-Yuan Yu

Jyh-Long Jeng

Shih-Yi Lin

Chen-Hsi Cheng

Sheng-Hung Lin

Chun-Yen Lin

Shih-Chieh Jang

Chi-En Kuan

Wen-Sheng Lin

Yeou-Geng Hsu

Chu-Chun Yu

Yi-Syuan Wang

Ching-Kuo Yeh

Chi-Yun Cheng

Chen Hsu

An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of wherein Ris each of Ris independently Calkylene group, m is an integer of 0 to 10, and m' is an integer of 1 to 10; n is an integer of 1 to 10, each of Ris independently hydrogen, saturated or unsaturated Chydrocarbon group, CF, silanol group, silyl group, or Al(OH); and Ris silanol group, silyl group, or Al(OH). The anhydride compound can be reacted with a diamine compound to form a polyimide.

Anhydride compound, polyimide, and thin film

An optical module and a light source are provided. The light source includes a circuit board, a plurality of light-emitting element chips, a plurality of total reflection elements, an encapsulant, and a plurality of optical wavelength conversion particles. The light-emitting element chips are disposed on the circuit board. Each of the light-emitting element chips is adapted to emit a light beam. The total reflection elements are disposed on the circuit board. Each of the total reflection elements is configured adjacent to one of the light-emitting element chips, a partial light beam of the light beam emitted by the one of the light-emitting element chips enters the total reflection element, and is transmitted in the total reflection element, and emits out from the total reflection element. The encapsulant covers the light-emitting element chips and the total reflection elements. The optical wavelength conversion particles are distributed in the encapsulant.

Optical module and light source

An illuminating module includes at least one light-emitting chip, a phosphor, and a color temperature conversion media. The light-emitting chip is capable of emitting wavelength light, and the phosphor is disposed in a propagation path of the wavelength light to transform the wavelength light into a first white light with a first color temperature. The color temperature conversion media is disposed in a propagation path of the first white light to transform the first white light into a second white light with a second color temperature. The second color temperature is smaller than the first color temperature.

Illumination module

A light source module includes a transparent element, a plurality of light-emitting devices, and a plurality of light diffusion micro-structures. The transparent element includes a transparent substrate having a light exiting surface and a bottom surface opposite to the light exiting surface, a plurality of first notches, and a plurality of second notches. The first notches are sunken at the light exiting surface. There is a reflection surface in each of the first notches. The second notches are respectively opposite to the first notches and sunken at the bottom surface. The second notches respectively have a light incident curve-surface. The light-emitting devices are respectively disposed beside the light incident curve-surfaces. Each of the light-emitting devices has a light exiting surface capable of providing a light beam. The light exiting surface is not conformal to the light incident curve-surface. The light diffusion micro-structures are disposed on the bottom surface.

Light source module and illumination apparatus

An electrode structure adapted for high applied voltage is provided, which comprises a conductive plate substrate and a covering layer disposed thereon such that a covering percentage of the covering layer over the conductive plate substrate is more than 50%. Since area of the conductive plate substrate covered by the covering layer is larger than the area exposed, the possibility of arcing is reduced and the breakdown voltage applied to the electrode structure may be increased.

Electrode structure adapted for high applied voltage and fabrication method thereof

A fire-resistant coating material comprising an organic/inorganic composite is disclosed. The organic/inorganic composite includes an organic component of polymer, monomer, oligomer, prepolymer, or copolymer having a first reactive functional group; inorganic particles; and optional additives. The inorganic particles possess a second reactive functional group, originally or after surface modification, which react with the first reactive functional group of the organic component to form chemical bonds. The organic/inorganic composite can be with admixed with a suitable continuous phase, depending on the type of the organic component, to provide a fire-resistant coating material.

Fire-resistant coating material

The invention discloses a fire-resistant wire or cable comprising a conductor wiring and a fire-resistant organic/inorganic composite as an insulation layer or an outer sheath. The organic/inorganic composite comprises an organic component of a polymer, oligomer, or copolymer having a first reactive functional group; and inorganic particles having a second reactive functional groups. The inorganic particles are chemically bonded to the organic component via a reaction between the first and the second reactive functional groups.

Fire-resistant wire/cable

The invention discloses a fire-resistant composite comprising inorganic particles well dispersed in a polymer, oligomer or copolymer having reactive functional groups. The inorganic particles also contain reactive functional groups, originally or after surface modification, that can react with the corresponding reactive functional groups of the organic component to form organic/inorganic composite materials. When the composite material is burned or exposed to fire, the organic component forms a char layer and the inorganic particles radiate absorbed heat. The inorganic particles also strengthen the mechanical properties of the structure through the reaction between inorganic and organic materials. The invention also discloses a fire-resistant plate containing the organic/inorganic component.

Organic/inorganic composite and fire-resistant plate utilizing the same

A multilayer fire-resistant material is provided, which comprises two or more layers formed of homogeneous or heterogeneous materials, with at least one layer being an organic/inorganic composite. The organic/inorganic composite comprises an organic component of a polymer, oligomer, or copolymer having a first reactive functional group, and inorganic particles having a second reactive functional group. The inorganic particles are chemically bonded to the organic component via a reaction between the first and the second reactive functional groups.

Growing community of inventors

Hsinchu, Taiwan

Chih-Ming Hu