Siliconware Precision Industries Co., Ltd.

Chih-Ming Cheng

Chao-Ya Yang

Chih-Hsien Chiu

Chien-Cheng Lin

Chia-Yang Chen

Tsung-Hsien Tsai

Heng-Cheng Chu

Yude Chu

Tsung-Hsien Hsu

A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Semiconductor package and fabrication method thereof

A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.

Growing community of inventors

Taichung Hsien, Taiwan

Chih-Ming Cheng