Radiant Opto-electronics Corporation

Radiant(guangzhou) Opto-electronics Co, Ltd

Chih-Ming Chan

Chao-Hsu Chen

Hung-Lin Chou

Pei-Ling Kao

Ren-Zhu Cao

Shu-Juan Song

Tian-Yu Zhao

Tsung-Hsin Liu

Wei-Ju Chen

Hung-Yi Hsu

Qing-Song Li

Fang-Chun Liu

A carrier tray and a carrier tray assembly using the same are described. The carrier tray includes a carrying portion, a surrounding wall and at least one recessed structure. The carrying portion has a top surface and a bottom surface opposite to the top surface. The surrounding wall is disposed around the carrying portion. The recessed structure is recessed into the carrying portion. The recessed structure has an opening and a recessed space, and the recessed space is communicated with the outside through the opening. There is a first distance defined by the recessed space along a first direction, and there is a second distance defined by the opening along the first direction. The first distance is greater than the second distance.

Carrier tray and carrier tray assembly using the same

A packaging structure is used for carrying at least one carried object. The packaging structure includes a carrying unit and a covering member. The carrying unit includes a supporting plate, at least one first side plate connected to the edge of the supporting plate, and at least one combing member. The supporting plate has two opposite surfaces, and the first side plate is able to bend to one of the surfaces of the supporting plate, so that the carrying unit can be folded or unfolded. The first side plate is stacked on the supporting plate when the carrying unit is in the folded state, and the combing member keeps the first side plate stacked on the supporting plate. The covering member positions the carried object on the carrying unit. A delivering device is provided for clamping and positioning a plurality of the packaging structures in an upright manner.

Packaging structure and delivering device

A back plate, a method for manufacturing the back plate and a backlight module are provided. The method for manufacturing the back plate includes the following steps. A main body is provided. The main body includes a bottom portion and at least one sidewall connected to the bottom portion. The sidewall has a plurality of grooves, and each of the grooves has a first side surface and a second side surface. A first recess and a second recess corresponding to the first recess are respectively disposed on the first side surface and the second side surface. An external force is applied on the bottom portion to form each of the bottom portion and the sidewalls into arc shape, in which the first side surface contacts the second side surface of each groove, and a hole portion is formed between the first recess and the second recess.

Back plate and method for manufacturing the same and backlight module

Growing community of inventors

Kaohsiung, Taiwan

Chih-Ming Chan