National Starch and Chemical Investment Holding Corporation

Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Chih-Min Cheng

Shuhua Jin

Andrew Collins

James Murray

Charles F Schuft

Yue Xiao

Gerald Fredrickson

Quinn K Tong

Bo Xia

Li Kang

Gerry Fredrickson

Daoqiang Lu

Zachary Bryan

Vito Buffa

Sun Hee Lehmann

Gunther Dreezen

George Thomas

Girish Hanchinamani

Jesse Lawrence Davis

Zachary Jacob Bryan

Photocurable (meth)acrylate compositions for forming features on the surfaces of membranes, and particularly, on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.

Photocurable (meth)acrylate compositions

Disclosed is a two-component curable polymeric system having increased viscosity. One component contains a homogeneous blend of a polyisocyanate and a homopolymer or copolymer of vinyl acetate. This component has a higher viscosity than the polyisocyanate alone, thereby increasing the viscosity of the two-component curable system. The other component of the two-component curable system is a composition containing an isocyanate reactive component. The polyisocyanate and the isocyanate reactive component react together ('cure') to form a polymer. Typically, but not always, the isocyanate reactive component is a polyol or polyamine that is capable of reacting with the polyisocyanate, thereby forming a polyurethane (polyol) or polyurea (polyamine).

Use of polyvinylacetate polymers or copolymers to increase the viscosity of the isocyanate component of a two-component curable polymeric system

A two part curable composition is provided, where the composition comprises:

Adhesive compositions

The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic component and a cure system for the epoxy resin component of the second part and a second part containing an epoxy resin component and a cure system for the (meth)acrylic component of the first part.

An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.

Composite film for board level EMI shielding

A radio frequency identification ('RFID') system antenna having adhesive pre-applied to one or more of its contact pads to allow for high speed attachment of the antenna to the RFID die or die strap. Also disclosed is a method for attaching an RFID antenna having pre-applied adhesive to a die or die strap.

RFID antenna with pre-applied adhesives

A low stress conductive film or paste adhesive that comprises a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) conductive filler. Additional ingredients, such as adhesion promoters and conductivity enhancers may also be utilized. The conductive film or paste adhesive provides higher adhesion strength than traditional flexible conductive film adhesives and a lower stress between the bonded components than existing high adhesion strength conductive films.

Low stress conductive adhesive

A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.

Conductive materials with electrical stability and good impact resistance for use in electronics devices

A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of nitrile rubber and carboxyl-terminated butadiene, carboxyl-terminated butadiene nitrile or a mixture thereof, and conductive filler particles.

Thermal interface material

A thermal interface member in a heat generating, electronic device is provided. The thermal interface member comprises either a single fluoroelastomer or a blend of fluoroelastomer components that are copolymers of hexafluoropropylene and vinylidene and consists of greater than 40% fluorine along the backbone, and one or more conductive fillers. The fluoroelastomer blend contains at least one component with a Mooney viscosity of 50 poise or less and at least one component with a Mooney viscosity of greater than 50 poise, while the single fluoroelastomer component may have a Mooney viscosity of either less than or greater than 50.

Electronic device containing thermal interface material

An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, a curing agent, optionally either a reactive or a nonreactive diluent and a corrosion inhibitor to provide the electrical stability.

Conductive materials with electrical stability for use in electronics devices

An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability. Alternatively, the composition may also include a low melting point metal filler component.

Growing community of inventors

Westford, MA, United States of America

Chih-Min Cheng