Lite-on Technology Corporation

Silitek Electronic (guangzhou) Co., Ltd.

Lite-on Electronics (guangzhou) Limited

Chih-Lung Liang

Yan-Yu Wang

Chen-Yu Chen

Shu-Hua Yang

Chia-Hao Wu

Shun-Chung Cheng

Jui-Lin Tsai

Jen-Min Huang

Hsiu-Tsu Wang

Yuan-Fu Chen

Chen-Hsiu Lin

Chih-Chiang Kao

Chin-Ming Cheng

An LED tube light includes a glass tube, a base, a light emitting unit, and two lateral cover assemblies. The base has a length larger than the length of the glass tube, wherein two opposite end portions of the base are arranged out of a region defined by orthographically projecting from the glass tube to the base. The light emitting unit is fixed on the base and is used for emitting light, passing through the glass tube to illuminate. The two lateral cover assemblies are respectively covered around the two end portions of the glass tube, wherein the two lateral cover assemblies are respectively installed on the two end portions of the base for maintaining the relative position between the cover assemblies and the base.

Led tube light

A LED luminaire includes a body portion having a lighting module and an optical structure formed integrally with the body portion. The optical structure is formed within the body portion and located in a light-projection direction of the lighting module. The optical structure substantially is a sheet-like structure with a first surface and a second surface. The first surface has at least two side portions with a first curvature, and the second surface has a second curvature. The first curvature is greater than the second curvature. Thereby, the view angle of the light is increased as the light generated from the lighting module passes through the optical structure.

LED luminaire

An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding cad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire.

LED module and LED lamp having the LED module

A luminaire includes a lamp holder, a first light-emitting module, a second light-emitting module, a light guide, and a lamp cover. The lamp holder has a top portion. The top portion includes a first upper face and a platform projecting upwardly from the first upper face. The platform has a second upper face at a top end thereof. The first light-emitting module is disposed on the first upper face and around the platform. The second light-emitting module is disposed on the second upper face. The light guide is disposed around the platform and on the first light-emitting module. The lamp cover is disposed on the lamp holder for covering the first light-emitting module, the second light-emitting module, and the light guide.

LED luminaire capable of increasing the view angle

A luminaire includes a lamp holder, a lamp cover and a plurality of first light-emitting modules. The lamp holder has a top surface, a plurality of protrusions protruding upwardly from the top surface. Each of the protrusions has an inclined surface. The lap cover is connected to the lamp holder, and covers the top surface and the inclined surfaces. Each of the first light-emitting modules includes a first light-emitting element. The view angle of the luminaire can be increased due to disposition of the first light-emitting elements on the inclined surfaces of the protrusions. Furthermore, since the first light-emitting elements are disposed on the protrusions, heat can be dissipated easily from the first light-emitting elements.

Luminaire having light-emitting elements disposed on protrusions

An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding pad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire.

A light emitting diode includes: a base with a concave portion; a light emitting chip disposed in the concave portion; an encapsulating layer filled in the concave portion; and an optical adjusting element disposed on the light emitting chip. Herein, the light emitting diode has a batwing distribution in a horizontal view angle, and the light emitting diode has a Lambertian distribution in a vertical view angle thereof.

Light emitting diode, backlight module, and light tube

A luminaire comprises a lamp holder, a lamp cover, a light-emitting module, and a light guide element. The lamp cover is assembled to the lamp holder to define an accommodating space therebetween. The lamp holder has a platform part protruding into the accommodating space. The light-emitting module is mounted to the platform part, and includes a circuit board and at least one LED disposed on the circuit board. The light guide element is mounted to the platform part, and covers the light-emitting module. The light guide element has an outer diameter longer than that of the platform part. The light guide element is shaped to allow light emitted from the LED to be transmitted out of the lamp cover through the light guide element in a lateral direction, and thus the view angle of the luminaire is increased.

Luminaire

An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively.

Surface mounted LED package

A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined distance in order to respectively receive the light-emitting chips to form light-exiting areas. The base has a reflecting portion opposite to the cavities. The reflecting portion is at least one inclined plane for reflecting light that have projected outside walls of the cavities to the peripheral area of the light-emitting areas in order to increase the uniformity of the light source. In addition, the light-emitting chips are arranged to form a line or surface light source of any sizes by adjusting the numbers of the cavity and the light-emitting chips.

Light-emitting diode module with a reflecting portion having two inclined planes opposite to each other

A lamp includes a lamp holder module and light-emitting module disposed in the lamp holder module. The lamp holder module includes a body, a pressing mechanism disposed on the body, and an upper cover engaging removably the body. The light-emitting module is placed on the body and is pressed into position through the pressing mechanism. The pressing mechanism is operable to release the light-emitting module, thereby facilitating removal and installation of the light-emitting module. The upper cover serves as a lens of the light-emitting module and covers the light-emitting module.

Lamp and lamp holder module thereof

A method for manufacturing an LED lens structure includes the following steps of disposing a lead frame with the LED chip into a mold, and injecting thermoplastic transparent material to a plane of the lead frame which is different from a plane that LED chip is mounted thereon to form a lens structure corresponding to the LED chip.

Growing community of inventors

Taipei, Taiwan

Chih-Lung Liang