Taiwan Semiconductor Manufacturing Comp. Ltd.

Chih-Kuo Chang

Hsu-Shui Liu

Feng-Kuang Wu

Sing-Tsung Li

Jiun-Rong Pai

Shou-Wen Kuo

Chih-Chang Hsieh

Chih-Ping Chen

Yung-Kai Lin

Wei-Ting Hsiao

Kai Lo

Chao-Keng Li

Wun-Kai Tsai

Chung-Chieh Hsu

Zheng-Jie Xu

Wen-Che Liang

Chian-Kun Chan

Chung-chieh Hsu

Chian-kun Chan

A fabrication system for fabricating an IC is provided which includes a processing tool, a computation device and a FDC system. The processing tool includes an electrode and an RF sensor to execute a semiconductor manufacturing process to fabricate the IC. The RF sensor wirelessly detects the intensity of the RF signal. The computation device extracts statistical characteristics based on the detection of the intensity of the RF signal. The FDC system determines whether or not the intensity of the RF signal meets a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the FDC system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

Arcing protection method and processing tool

Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

Techniques for detecting micro-arcing occurring inside a semiconductor processing chamber

An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.

Semiconductor apparatus with transportable edge ring for substrate transport

Growing community of inventors

Baoshan, China

Chih-Kuo Chang