Chunghwa Picture Tubes, Ltd.

Chih-kun Lin

Yu-Fang Wang

Ren-tsai Hung

Chun-lang Chiu

Heng-Chang Lin

Ming-kang Huang

Ming-Kang Huang

A probe includes a wire and a bump, wherein the wire is formed on a substrate; and the bump is formed upon the wire. In addition, a probe block includes a plurality of probes disposed on a substrate, so that the probe block is composed of a plurality of wires and bumps. The wires are disposed on the substrate and each bump is disposed accurately upon an end of each wire. The bump and the wire of the probe in accordance with the present invention are formed jointlessly. A method of fabricating the probe is characterized in that a grayscale mask is utilized to form the wire on the substrate and form the bump upon the wire by using a single masking process.

Probe and method fabricating the same

A peripheral circuit disposed on a substrate having an active device array is provided. The peripheral circuit includes first test pads, second test pads, first lines, and second lines. The first and the second lines are electrically connected to the active device array. Each first test pad includes a first conductive layer and a second conductive layer electrically connected to the first conductive layer. The first conductive layer electrically connects at least two of the adjacent first lines. The second test pads are interposed between the first test pads and the active device array. Each second test pad includes third conductive layers and a fourth conductive layer electrically connected to the third conductive layers. The first lines pass through the third conductive layers and are insulated from the fourth conductive layer. Each third conductive layer is electrically connected to one of the adjacent second lines respectively.

Peripheral circuit

Growing community of inventors

Hsinchu, Taiwan

Chih-kun Lin