Inventec Corp.

Inventec (Pudong) Technology Corporation

Chih Kai Yang

Yi-Lun Cheng

An air cooling system for electronic devices includes a body, a thermal conduction component, and a heat dissipation fan. The body has a heat dissipation port and air inlet ports. The air inlet ports are disposed at a first housing part and a second housing part of the body. The first housing part is opposite to the second housing part. The thermal conduction component is disposed in the body and configured to contact a heat source. The heat dissipation fan is disposed in the body. The heat dissipation fan includes a first axial air inlet opening, a second axial air inlet opening, and radial air outlet openings. The first axial air inlet opening corresponds to one of the air inlet ports of the first housing part. The second axial air inlet opening corresponds to one of the air inlet ports of the second housing part.

Air cooling system

A heat dissipating system for electronic devices includes a first heat dissipation device, a second heat dissipation device, and a thermal conduction component. The thermal conduction component is disposed around the first heat dissipation device and configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dispersed in a plurality of directions directing away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction directing away from the second heat dissipation device.

Growing community of inventors

Taipei, Taiwan

Chih Kai Yang